Thermal glue AG TermoGlue 10g
ID: 551083
zł9.20
Tax included
zł7.48 tax excl.
The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-116
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14 days for return
Each consumer can return the purchased goods within 14 days
Description
AG TermoGlue thermally conductive adhesive is used to fix heat sinks located, among others, in on memory chips, transistors or bridges. It's a great way to create lasting connections. Thanks to the use of glue, excellent heat conduction parameters are obtained. Another application is connecting and filling gaps between heating elements. It is worth remembering not to exceed the maximum thickness, which is 6 mm. It took about 24 hours for the white thermally conductive adhesive to dry.
properties
- Heat-conducting glue
- White color
- Thermal conductivity: 1 W / mK
- Maximum working temperature: 200 ° C
- Electrical puncture resistance: min. 20 kV / mm
- Tensile strength: 2 MPa
- Dielectric constant: 3
- Drying time: 8 minutes
- Weight: 10 g (net)
551083
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