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Thermally conductive tape used as a replacement for thermally conductive paste. They are very flexible and characterized by high compressibility. AG Termopasty ART.AGT-161
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free shipping in Poland for all orders over 500 PLN
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14 days for return
Each consumer can return the purchased goods within 14 days
Description
Thermally conductive tapes used as a replacement for thermally conductive paste. They are very flexible and characterized by high compressibility, which ensures a good fit to the elements that require cooling. It is used as an element mounted between heat-generating semiconductors and a heat spreader, to fill the air spaces between the computer motherboard and the heat sink, and in LED lighting systems.
Features
- Thermal conductivity: 6 W/mK
- Density: 3 g/cm3
- Hardness: 30 (Shore)
- Working temperature: -60 to 200oC
- Resistance: 1.1 x 1011 Ohm/m
- Dielectric constant [1000 Hz]: 7.5
- Thickness: 3 mm
- Dimensions: 30 x 30 mm
- Packaging: string bag
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Silicone thermal grease used to improve the amount of heat transferred to, for example, the heat sink. The paste is resistant to oxidation and operating temperature in the range from -50 to 200 ° C. Paste in a syringe with a capacity of 25 g. AG Termopasty ART.AGT-056
Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-057
AG Gold is a thermal paste with the addition of gold. It has an exceptionally high thermal conductivity (>2.8 W/mK), which is up to three times higher than most traditional products. 3g paste in a syringe. AG Termopasty ART.AGT-106
The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-116
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