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Along with volume 11, this volume reviews how transition metal organometallic compounds are used in organic synthesis. Chapters cover one element and are sub-divided by type of reaction to be readily accessible by organic chemists. Classes of reactions reviewed include C-H, C-C, C-O, C-N and C-E bond formation (E= Si, Sn, B, Te, S, P)
* valuable content available May 2009 as an individual volume
* separate volumes will appeal to a wider chemistry and materials science audience
* priced for individual researcher as well as library purchase
C-H Bond Formation
C-H Bond Formation by Asymmetric and Stereoselective Hydrogenation
C-H Bond Formation: Through Isomerization
Synthetic Reactions via C-H Bond Activation
Synthetic Reactions via C-H Bond Activation: C-C and C-E Bond Formation
Synthetic Reactions via C-H Bond Activation: Carbene and Nitrene C-H Insertion
Synthetic Reactions via C-H Bond Activation: Oxidation of C-H Bonds
C-C Bond Formation (Part 1) by Addition Reactions
C-C Bond Formation (Part 1) by Addition Reactions: through Carbometallation Mediated by Group 4-7 Metals
C-C Bond Formation (Part 1) by Addition Reactions: through Carbometallation Catalyzed by Group 8-11 Metals
C-C Bond Formation through Conjugate Addition of C-M to C=C-C=O and C=C-NO2
C-C Bond Formation Through Addition of C-M to C=O, C=N, and CN Bonds
Metal-catalyzed Reductive Carbocyclization (C=C, CC, C=O Bonds)
C-C Bond Formation through Reaction of CO2 with CC and C=C-C=C
C-C Bond Formation (Part 1) by Addition Reactions: Alder-ene Reaction
C-C Bond Formation (Part 1) by Addition Reactions: Higher-order Cycloadditions
C-O and C-N Bond Formation
C-O Bond Formation through Transition Metal-mediated Etherification
C-N Bond Formation through Amination
C-E Bond Formation (E = Si, Sn, B, Te, S, P)
C-E Bond Formation through Element-Element Addition to Carbon-Carbon Multiple Bonds
C-E Bond Formation through Hydrosilylation of Alkynes and Related Reactions
C-E Bond Formation through Asymmetric Hydrosilylation of Alkenes
C-E Bond Formation through Hydroboration and Hydroalumination
Index
DEV-10628 - MP3 Player Shield, OSHW In Fritzing Library, SparkFun
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Arduino Fio to płytka z mikrokontrolerem ATmega328V z możliwością zasilania baterią LiPol, na pokładzie jest również ładowarka. Dodatkowym atutem jest złącze XBee
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Moduł z odbiornikiem GPS Venus638FLPx wyposażony w złącze SMA. SparkFun GPS-11058
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Moduł PowerCell umożliwia zasilanie systemów 3,3V oraz 5V z pojedynczego ogniwa litowo-polimerowego (LiPol). Wbudowana ładowarka. SparkFun PRT-11231
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Moduł ładowarki pojedynczego ogniwa LiIon lub LiPol. Prąd ładowania 100 lub 500 mA. Zasilanie przez gniazdo mini-USB. PRT-10161
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Moduł przetwornicy Step-up NCP1402, zakres napięć wejściowych to 1..4 V, napięcie wyjściowe 5V. PRT-10968
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SEN-10121 - IMU Digital Combo Board - 6 Degrees of Freedom ITG3200/ADXL345
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Moduł ZigBee o mocy wyjściowej 1 mW (0 dBm), prędkość do 250 kb/s, zasięg do 100 m, 6 linii ADC (10-bitowych), 8 linii GPIO. Wbudowana antena prętowa.
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Platforma gąsienicowa wyposażoną w cztery niezależne silniki z enkoderami i koszyk na sześć baterii AA. Sparkfun ROB-10336
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