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This volume reviews the preparation, properties, reactions and special applications of group 5 to 7 organometallic compounds. Each chapter examines the compounds formed between Vanadium, Niobium, Tantalum, Chromium, Molybdenum, Tungsten, Manganese, Technetium and Rhenium and specific ligands. It provides a clear and comprehensive overview of developments since 1993 and attempts to predict trends in the field over the next ten years. Like its predecessors, COMC (1982) and COMC-II (1995), this new work is the essential reference text for any chemist or technologist who needs to use or apply organometallic compounds.
* valuable content available May 2009 as an individual volume
* separate volumes will appeal to a wider chemistry and materials science audience
* priced for individual researcher as well as library purchase
Vanadium Organometallics; Niobium Organometallics; Tantalum Organometallics; Chromium Compounds with CO or Isocyanides; Chromium Compounds without CO or Isocyanides; Molybdenum Compounds with CO or Isocyanides; Molybdenum Compounds without CO or Isonitrile Ligands; Tungsten Compounds with CO or Isocyanides; Tungsten Compounds without CO or Isocyanides; Manganese Compounds with CO Ligands; Manganese Compounds without CO or Isocyanides; Technetium Organometallics; Rhenium Compounds
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Moduł moduł z 12-bitowym konwerterem ADC ADC121C021. Płytka została wyposażona w złącze Grove i komunikuje się przez interfejs I2C. Seeed Studio 103020013
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Moduł z czujnikiem światła ultrafioletowego UV VEML6075. Umożliwia pomiar poziomu promieniowania UVA (350-375 nm) i UVB (315-340 nm). Komunikuje się poprzez magistralę I2C. DFRobot SEN0303
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Shield do STM32 Nucleo, posiada dwa mikrofony cyfrowe MP34DT01-M wykonane w technologii MEMS.
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Listwa zaciskowa żeńska, 5-pinowa. Raster 3,81 mm. Wysokość 11,1 mm. 15EDGK-3.81-5P
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Moduł GSM/GPRS czterozakresowy SMD, SIMcom, RoHS
Dostępny do wyczerpania magazynu!
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ARM Cortex-M3 MCU, 128 kB Flash, 32 kB SRAM, USB Device/Host, CAN, DAC, LQFP80, RoHS
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