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5, 7 organometallic compounds. Each chapter examines the compounds formed between Vanadium, Niobium, Tantalum, Chromium, Molybdenum, Tungsten, Manganese, Technetium and Rhenium and specific ligands. It provides a clear and comprehensive overview of developments from 1993 and attempts for the next ten years. Like its predecessors, COMC (1982) and COMC-II (1995), this is a chemist or technologist who needs to use or apply organometallic compounds.
* valuable content available May 2009 as an individual volume
* separate energies will appeal to chemistry and materials science audience
* priced for individual researcher
Vanadium Organometallics; Niobium Organometallics; Tantalum Organometallics; Chromium Compounds with CO or Isocyanides; Chromium Compounds without CO or Isocyanides; Molybdenum Compounds with CO or Isocyanides; Molybdenum Compounds without CO or Isonitrile Ligands; Tungsten Compounds with CO or Isocyanides; Tungsten Compounds without CO or Isocyanides; Manganese Compounds with CO Ligands; Manganese Compounds without CO or Isocyanides; Technetium Organometallics; Rhenium Compounds
Genesys Virtex-5 FPGA Development Board - development kit
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Starter kit with STM32MP157A application microprocessor (combination of a typical processor with Cortex-A7 core and microcontroller with Cortex-M4 core). The system allows users to create applications using the STM32 MPU OpenSTLinux Distribution software for the main processor and the STM32CubeMP1 software for the coprocessor. STMicroelectronics STM32MP157A-DK1
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Assembled sparkler - optical siren. AVT791 C
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Jerzy Tyszer, Grzegorz Mrugalski, Artur Pogiel, Dariusz Czysz
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Module with 17x7 LED matrix display (119 LEDs) designed to work with the Raspberry Pi. It uses the IS31FL3731 driver and communicates via the I2C interface. Pimoroni PIM332
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HK Turnigy Heat Shrink Tube 40mm Blue (1mtr) (13837)
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