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Category: BGA balls
BGA Balls
BGA (Ball Grid Array) balls are an essential element in surface-mount technology, used mainly in advanced electronic systems. At Kamami, we offer a wide range of BGA balls that meet the requirements of both professionals and hobbyists. Our products, such as BGA Balls 0.3mm Sn63/Pb37 25k, BGA Balls 0.55mm Sn63/Pb37 25k, and BGA Balls 0.6mm Sn63/Pb37 25k, are characterized by high quality and reliability.
There are 6 products.
BGA balls with a diameter of 0.5mm and composition Sn63/Pb37. The container has 25 000 pieces.
BGA balls with a diameter of 0.35mm and composition Sn63/Pb37. The container has 25 000 pieces.
BGA balls with a diameter of 0.6mm and composition Sn63/Pb37. The container has 25 000 pieces.
BGA balls with a diameter of 0.55mm and composition Sn63/Pb37. The container has 25 000 pieces.
BGA balls with a diameter of 0.3mm and composition Sn63/Pb37. The container has 25 000 pieces.
BGA balls with a diameter of 0.65mm and composition Sn63/Pb37. The container contains 25 000 pieces.
Purpose and Application of BGA Balls
BGA balls are used in many areas of electronics, from consumer devices to medical and industrial equipment. They enable the creation of complex and efficient connections between components on printed circuit boards (PCB). Thanks to their precision and reliability, BGA balls are an ideal solution for mounting microprocessors, integrated circuits, and other advanced electronic components.
Precision Connections in Advanced Electronics
BGA Balls 0.3mm Sn63/Pb37 25k are perfect for creating precise and durable connections in advanced electronic systems. Made from high-quality Sn63/Pb37 alloy, they provide excellent conductivity and reliability. They are widely used in applications requiring high precision and durability.
High Quality and Reliability
BGA Balls 0.55mm Sn63/Pb37 25k offer excellent soldering properties, making them an ideal choice for professional applications. Their optimal size and chemical composition ensure connection stability and minimize the risk of defects during assembly. They are perfect for applications requiring high reliability and strength.
Indispensable for High-Demand Projects
BGA Balls 0.6mm Sn63/Pb37 25k are indispensable in advanced electronic projects where precision and durability are key. Made from high-quality materials, these balls provide excellent electrical conductivity and mechanical stability of connections. They are commonly used in the assembly of integrated circuits and other critical electronic components.
Wide Selection of BGA Balls at Kamami
At Kamami, you will find a wide selection of BGA balls that meet the highest quality standards. We offer products in various sizes and specifications, tailored to the needs of both professionals and hobbyists. Our BGA balls, such as BGA Balls 0.3mm Sn63/Pb37 25k, BGA Balls 0.55mm Sn63/Pb37 25k, and BGA Balls 0.6mm Sn63/Pb37 25k, guarantee connection reliability and durability. We invite you to explore our offer and choose the BGA balls that best meet your needs.