- Out-of-Stock
 
        
           
         
          | Author: Daniel W. Lewis ISBN: 83-7243-412-3 Format: B5, 300 pages Includes CD-ROM Publisher: RM Original edition: Fundamentals of Embedded Software: Where C and Assembly Meet Prentice Hall | 
| About the book | 
| This book is a great alternative to traditional university texts on computer organization and programming in assembler language. Assembler appears in it as it is most often used in practice - as a tool to implement small, fast and specialized procedures called from a main program written in a high level language, such as C. Based on embedded software, the book introduces multithreaded programming techniques, systems with expropriation and expropriation, shared resources and scheduling, thus providing a solid foundation for further learning of operating systems, real-time systems and microprocessor-based design. The book should help: 
 Table of Contents Preface Chapter 1 Introduction 1.1 What is a built-in system? Chapter 2 Data representation 2.1 Binary numbers with constant precision Chapter 3 Maximum use of C 3.1. Total types Chapter 4 The programmer's view on building a computer 4.1 Memory Chapter 5 Combining C language and assembly language 5.1 Programming in assembler Chapter 6 Programming the input / output 6.1 I / O instructions for Intel processors Chapter 7 Concurrent software 7.1 Multi-level systems Chapter 8 Sorting tasks 8.1 Thread states Chapter 9 Memory management 9.1 Objects in C language Chapter 10 Shared memory 10.1 Identifying shared objects Chapter 11 System initialization 11.1. Organization of memory Appendix A Contents of the CD-ROM Appendix B Compiler C / C ++ DJGPP Installation Appendix C NASM Assembler Installation Appendix D Program designs CD files required by all applications Appendix E libepc library Memory organization and initialization Appendix F Pre-loading program Index | 
Thermally conductive tape used as a replacement for thermally conductive paste. They are very flexible and characterized by high compressibility. AG Termopasty ART.AGT-161
 No product available!
ROSA3D filament made of high-quality, recycled PLA. 1 kg of 1.75 mm filament is wound on the spool. ROSA3D R-PLA Black
 No product available!
 No product available!
 No product available!
KAmodLSM303 is a module that allows you to measure the acceleration and the value of the magnetic field.
 No product available!
 No product available!
 No product available!
 No product available!
 No product available!
 No product available!
Printed circuit board and programmed car computer system with LCD display, white marks. AVT3095 / 01 A +
 No product available!
 No product available!
 No product available!
Pre-installed Android4.4 or latest version for ODROID-XU3 and XU4. Ready to run out of box 8Gbyte eMMC Version 5.0 interface from Toshiba. JEDEC/MMCA version 5.0:HS400 interface with 8bit DDR mode
 No product available!
HK 10x4.7 SF Carbon Fiber Propellers L/H and R/H Rotation (1 pair) (39773)
 No product available!
 No product available!
