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Lead-free tin Bi57Sn42Ag1 without flux, 25 g spool, diameter 0.70 mm. Bi57Sn42Ag1/0.70/0.025/BT
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Cynel lead-free tin without flux on a 25 g spool, diameter 0.70 mm. Bi57Sn42Ag1 alloy manufactured from the purest raw materials in accordance with ISO EN 9453:2014. Binder intended for manual and automatic soft soldering in electronics, electrical engineering and other industries where compliance with the requirements of the RoHS2 directive is required.
Chemical characteristics
Pb | Sb | Cu | Au | In | Ag | Al | As | Cd | Fe | Ni | Zn |
---|---|---|---|---|---|---|---|---|---|---|---|
0,07 | 0,1 | 0,5 | 0,05 | 0,1 | 1,2 | 0,001 | 0,03 | 0,002 | 0,02 | 0,01 | 0,001 |
Physical characteristics
The sucker is a tool necessary to remove excess brazing material during desoldering of electronic components. NAR0032
No product available!
The HQ-192 sucker is used to remove excess tin. NAR0019
Soldering tape used to collect excess tin with a gray 1.5 mm, 1.5 m long
Tape, in the form of a braid, to remove the excess of molten solder brazing material during soldering and desoldering of electronic components 1.5m
Tape, in the form of a braid, to remove the excess of molten solder brazing material during soldering and desoldering of electronic components 1.5m
No product available!
Lead-free tin Bi57Sn42Ag1 without flux, 25 g spool, diameter 0.50 mm. Bi57Sn42Ag1/0.50/0.025/BT
Lead-free tin Bi57Sn42Ag1 without flux, 25 g spool, diameter 0.70 mm. Bi57Sn42Ag1/0.70/0.025/BT