

Cynel lead-free tin without flux on a 25 g spool, diameter 0.50 mm. Bi57Sn42Ag1 alloy manufactured from the purest raw materials in accordance with ISO EN 9453:2014. Binder intended for manual and automatic soft soldering in electronics, electrical engineering and other industries where compliance with the requirements of the RoHS2 directive is required.
Chemical characteristics
Pb | Sb | Cu | Au | In | Ag | Al | As | Cd | Fe | Ni | Zn |
---|---|---|---|---|---|---|---|---|---|---|---|
0,07 | 0,1 | 0,5 | 0,05 | 0,1 | 1,2 | 0,001 | 0,03 | 0,002 | 0,02 | 0,01 | 0,001 |
Physical characteristics
Manufacturer CYNEL-UNIPRESS SPÓŁKA Z OGRANICZONĄ ODPOWIEDZIALNOŚCIĄ Białołęcka 231 B 03-253 Warszawa Poland cynel@cynel.com.pl
Responsible person CYNEL-UNIPRESS SPÓŁKA Z OGRANICZONĄ ODPOWIEDZIALNOŚCIĄ Białołęcka 231 B 03-253 Warszawa Poland formularz kontaktowy na stronie osoby odpowiedzialnej
The sucker is a tool necessary to remove excess brazing material during desoldering of electronic components. NAR0032
No product available!
Tape, in the form of a braid, to remove the excess of molten solder brazing material during soldering and desoldering of electronic components 1.5m
Tape, in the form of a braid, for removing excess molten solder binder when soldering and desoldering electronic components, 1.5mm wide and 1.5m long.
Tape, in the form of a braid, for removing excess molten solder binder when soldering and desoldering electronic components, 3mm wide and 1.5m long.
Lead-free tin Bi57Sn42Ag1 without flux, 25 g spool, diameter 0.70 mm. Bi57Sn42Ag1/0.70/0.025/BT
Lead-free tin Bi57Sn42Ag1 without flux, 25 g spool, diameter 1.00 mm. Bi57Sn42Ag1-B/T
Lead-free tin Bi57Sn42Ag1 without flux, 25 g spool, diameter 0.50 mm. Bi57Sn42Ag1/0.50/0.025/BT