Category: Pastes, adhesives and thermally conductive tape
Glues, pastes and thermally conductive tape are substances that have high thermal conductivity. Heat transfer pastes applied to the systems eliminate unevenness in contact with radiators thus increasing the amount of heat dissipated.
There are 73 products.
Silicone thermal grease used to improve the amount of heat transferred to, for example, the heat sink. The paste is resistant to oxidation and operating temperature in the range from -50 to 200 ° C. Paste in a tube with a capacity of 7 g. AG Termopasty ART.AGT-055
AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. 0.5g paste in a sachet. AG Termopasty ART.AGT-143
HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-127
Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-057
Foam with a density of 0.99 g/cm3 and a slightly alkaline pH (7-8) helps to find any gas or air leaks. AG Termopasty ART.AGT-133
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-137
Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-144
Heat Grease Thermal Grease based on copper with a thermal conductivity of approx. 3.1 W / mK. AG Termopasty ART.AGT-061
The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-116
AG Gold is a thermal paste with the addition of gold. It has an exceptionally high thermal conductivity (>2.8 W/mK), which is up to three times higher than most traditional products. 3g paste in a syringe. AG Termopasty ART.AGT-106
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-138
Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). 3g paste in a syringe. AG Termopasty ART.AGT-108
Heat Grease Thermal Grease based on copper with a thermal conductivity of approx. 3.1 W / mK. AG Termopasty ART.AGT-060
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-140
AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. A paste weighing 1000 g in a plastic box. AG Termopasty ART.AGT-146
TO220 thermal conductive pads are characterized by high thermal conductivity (1.5 W/mK) and at the same time are an effective electrical insulator. They can be used with various types of transistors, improving their work. They do not contain glue. AG Thermopaste ART.AGT-241
AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-306
AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-305
TO thermal conductive pads are characterized by high thermal conductivity (1.5 W/mK) and at the same time are an effective electrical insulator. They can be used with various types of transistors, improving their work. They do not contain glue. AG Thermopaste ART.AGT-243
The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-180