New products
New products
Category: Pastes and adhesives thermally conductive
Thermal Pastes, Adhesives, and Tapes Available at Kamami
Thermal pastes, adhesives, and tapes are crucial in ensuring proper cooling of electronic components. At Kamami, we offer a wide range of these products to meet the needs of both amateurs and professionals. Our selection includes thermal pastes, thermal adhesives, and thermal tapes that provide effective heat dissipation, essential for maintaining optimal operation of electronic devices. Among our products, you will find AG TermoGlue thermal adhesive 10g, Silicone thermal paste H in a 7g tube, AG double-sided thermal tape 30x30x2.0 (6 W/mK), and HP thermal paste 100g in a plastic container.
There are 37 products.
Heat Grease Thermal Grease based on copper with a thermal conductivity of approx. 3.1 W / mK. AG Termopasty ART.AGT-060
AG Gold is a thermal paste with the addition of gold. It is characterized by high thermal conductivity (>2.8 W/mK), which is up to three times higher than in the case of introducing products. AG Termopasty ART.AGT-119
AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. A paste weighing 1000 g in a plastic box. AG Termopasty ART.AGT-146
Silicone thermal paste used to improve the amount of heat transferred to, for example, a radiator. The paste is resistant to oxidation and operating temperatures ranging from -50 to 200°C. Paste in a cartridge with a capacity of 800 g. AG Termopasty ART.AGT-309
Silicone thermal grease used to improve the amount of heat transferred to, for example, the heat sink. The paste is resistant to oxidation and operating temperature in the range from -50 to 200 ° C. Paste in a syringe with a capacity of 25 g. AG Termopasty ART.AGT-056
HPX thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-126
Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). 3g paste in a syringe. AG Termopasty ART.AGT-108
Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-058
The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-180
Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 100g in a plastic box. AG Termopasty ART.AGT-247
HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-113
AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. A paste weighing 1000 g in a plastic box. AG Termopasty ART.AGT-149
No product available!
Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-059
No product available!
N silicone paste with a density of 1.02-1.04 g/cm3 is a product characterized by protective properties. It preserves rubber in particular, as well as plastics, preventing punctures. AG Termopasty ART.AGT-054
No product available!
HPX thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-114
No product available!
Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 1000g in a plastic box. AG Termopasty ART.AGT-150
No product available!
Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-120
No product available!
Thermal Pastes for Efficient Cooling
Thermal paste is an essential material in any CPU cooling system. It provides excellent heat conduction between the processor and the heatsink, which is crucial for maintaining low operating temperatures. Products such as Silicone thermal paste H - 7g tube and HP thermal paste 100g in a plastic container offer high performance and ease of application, making them ideal choices for both hobbyists and professionals.
Thermal Adhesives for Durable Connections
Thermal adhesives are excellent solutions for permanently bonding electronic components that require efficient heat dissipation. AG TermoGlue thermal adhesive 10g ensures high thermal conductivity and a durable bond, which is essential in many electronic applications where reliable cooling is needed.
Thermal Tapes for Easy Application
Thermal tapes are ideal for those looking for simple and effective methods to mount cooling components. AG double-sided thermal tape 30x30x2.0 (6 W/mK) offers excellent conductive properties and ease of use, allowing for quick and hassle-free attachment of heatsinks to integrated circuits and other elements.
Why Choose Our Thermal Pastes, Adhesives, and Tapes?
By choosing thermal products available at Kamami, you gain access to the highest quality materials that meet rigorous standards. Our selection includes a wide range of products tailored to different user needs. Each product is thoroughly described, and technical specifications make it easy to make the right choice. Our team of experts is always ready to provide professional advice and assistance in selecting the appropriate materials. With Kamami, every electronics-related task becomes more efficient and reliable.