zł21.06 tax excl.
ART.AGT-324 Carbon thermal paste with a thermal conductivity of 15.2 W/mK effectively transfers heat from processors, graphics cards, and other components. Its stable and durable formula with carbon nanoparticles ensures high cooling performance and safe use in demanding systems.
ART.AGT-324 Carbon thermal paste is designed for heat dissipation from processors, GPUs, and other electronic components. With carbon nanoparticles and high thermal conductivity of 15.2 W/mK, it ensures efficient heat transfer and stable operation even under heavy loads. The paste does not evaporate, does not flow, and maintains its properties over a wide temperature range. Compatible with aluminum, copper, and ceramic surfaces, it prevents electrocorrosion and provides safe use in gaming PCs, workstations, and high-performance cooling systems.
Manufacturer AG TermoPasty Grzegorz Gąsowski Kolejowa 33E 18-218 Sokoły Poland info@termopasty.pl
Responsible person AG TermoPasty Grzegorz Gąsowski Kolejowa 33E 18-218 Sokoły Poland info@termopasty.pl
Silicone thermal grease used to improve the amount of heat transferred to, for example, the heat sink. The paste is resistant to oxidation and operating temperature in the range from -50 to 200 ° C. Paste in a syringe with a capacity of 25 g. AG Termopasty ART.AGT-056
Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-057
AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. 3g paste in a syringe. AG Termopasty ART.AGT-107
No product available!
Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). 3g paste in a syringe. AG Termopasty ART.AGT-108
AG Gold is a thermal paste with the addition of gold. It has an exceptionally high thermal conductivity (>2.8 W/mK), which is up to three times higher than most traditional products. 3g paste in a syringe. AG Termopasty ART.AGT-106
Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 1g in a syringe. AG Termopasty ART.AGT-162
AG Gold is a thermal paste with the addition of gold. It is characterized by high thermal conductivity (>2.8 W/mK), which is up to three times higher than in the case of introducing products. AG Termopasty ART.AGT-163
AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. A paste weighing 1g in a syringe. AG Termopasty ART.AGT-164
The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-116
Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-144
AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. 0.5g paste in a sachet. AG Termopasty ART.AGT-143
Heat Grease Thermal Grease based on copper with a thermal conductivity of approx. 3.1 W / mK. AG Termopasty ART.AGT-061
Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 1000g in a plastic box. AG Termopasty ART.AGT-150
No product available!
Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 100g in a plastic box. AG Termopasty ART.AGT-247
AG Gold is a thermal paste with the addition of gold. It is characterized by high thermal conductivity (>2.8 W/mK), which is up to three times higher than in the case of introducing products. AG Termopasty ART.AGT-119
The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-180
ART.AGT-324 Carbon thermal paste with a thermal conductivity of 15.2 W/mK effectively transfers heat from processors, graphics cards, and other components. Its stable and durable formula with carbon nanoparticles ensures high cooling performance and safe use in demanding systems.