Thermal glue AG TermoGlue 120g

AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. 3g paste in a syringe. AG Termopasty ART.AGT-107

Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). 3g paste in a syringe. AG Termopasty ART.AGT-108

Thermal paste with gold particles, designed to fill microscopic surface irregularities between components requiring efficient heat transfer, including processors, electronic components and heatsinks. Thermal conductivity is >3.57 W/mK, with an operating temperature range from -50°C to 250°C and short-term temperature resistance up to 340°C. The paste provides good dielectric properties and can also be used in industrial equipment and energy systems. The ART.AGT-106 variant is supplied in a syringe containing 3 g of paste. AG TermoPasty ART.AGT-106

Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 1g in a syringe. AG Termopasty ART.AGT-162

Thermal paste with gold particles, designed to fill microscopic surface irregularities between components requiring efficient heat transfer, including processors, electronic components and heatsinks. Thermal conductivity is >3.57 W/mK, with an operating temperature range from -50°C to 250°C and short-term temperature resistance up to 340°C. The paste provides good dielectric properties and can also be used in industrial equipment and energy systems. The ART.AGT-163 variant is supplied in a syringe containing 1 g of paste. AG TermoPasty ART.AGT-163

AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. A paste weighing 1g in a syringe. AG Termopasty ART.AGT-164

The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-116

Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-144

AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. 0.5g paste in a sachet. AG Termopasty ART.AGT-143

Heat Grease Thermal Grease based on copper with a thermal conductivity of approx. 3.1 W / mK. AG Termopasty ART.AGT-061

Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 1000g in a plastic box. AG Termopasty ART.AGT-150

Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 100g in a plastic box. AG Termopasty ART.AGT-247

Thermal paste with gold particles, designed to fill microscopic surface irregularities between components requiring efficient heat transfer, including processors, electronic components and heatsinks. Thermal conductivity is >3.57 W/mK, with an operating temperature range from -50°C to 250°C and short-term temperature resistance up to 340°C. The paste provides good dielectric properties and can also be used in industrial equipment and energy systems. The ART.AGT-119 variant is supplied in a plastic container holding 100 g of paste. AG TermoPasty ART.AGT-119

The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-180

AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. A paste weighing 100 g in a plastic box. AG Termopasty ART.AGT-118

Foam with a density of 0.99 g/cm3 and a slightly alkaline pH (7-8) helps to find any gas or air leaks. AG Termopasty ART.AGT-133