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Thermal glue AG TermoGlue 120g
ID: 1184122
5901764327738
zł72.80
Tax included
zł59.19 tax excl.
The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-180
Free shipping
free shipping in Poland for all orders over 500 PLN
Same day shipping
If your payment will be credited to our account by 11:00
14 days for return
Each consumer can return the purchased goods within 14 days
Description
AG TermoGlue thermally conductive adhesive is used to fix heat sinks located, among others, in on memory chips, transistors or bridges. It's a great way to create lasting connections. Thanks to the use of glue, excellent heat conduction parameters are obtained. Another application is connecting and filling gaps between heating elements. It is worth remembering not to exceed the maximum thickness, which is 6 mm. It took about 24 hours for the white thermally conductive adhesive to dry.
properties
- Heat-conducting glue
- White color
- Thermal conductivity: 1 W / mK
- Maximum working temperature: 200 ° C
- Electrical puncture resistance: min. 20 kV / mm
- Tensile strength: 2 MPa
- Dielectric constant: 3
- Drying time: 8 minutes
- Weight: 120 g (net)
1184122
Data sheet
- Capacity
- 120 g
- Type of packaging
- Tube
- Dispenser type
- Cap
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