Thermal glue AG TermoGlue 120g
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  • Thermal glue AG TermoGlue 120g
ID: 1184122
5901764327738
zł68.51
Tax included

zł55.70 tax excl.

The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-180

24h
Available
Available quantity: 1
 

Free shipping

free shipping in Poland for all orders over 500 PLN

 

Same day shipping

If your payment will be credited to our account by 11:00

 

14 days for return

Each consumer can return the purchased goods within 14 days

Description

AG TermoGlue thermally conductive adhesive is used to fix heat sinks located, among others, in on memory chips, transistors or bridges. It's a great way to create lasting connections. Thanks to the use of glue, excellent heat conduction parameters are obtained. Another application is connecting and filling gaps between heating elements. It is worth remembering not to exceed the maximum thickness, which is 6 mm. It took about 24 hours for the white thermally conductive adhesive to dry.

properties

  • Heat-conducting glue
  • White color
  • Thermal conductivity: 1 W / mK
  • Maximum working temperature: 200 ° C
  • Electrical puncture resistance: min. 20 kV / mm
  • Tensile strength: 2 MPa
  • Dielectric constant: 3
  • Drying time: 8 minutes
  • Weight: 120 g (net)
1184122

Data sheet

Capacity
120 g
Type of packaging
Tube
Dispenser type
Cap

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