Thermal paste AG with the addition of copper - 1.5 ml syringe

Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-057

AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. 3g paste in a syringe. AG Termopasty ART.AGT-107

Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). 3g paste in a syringe. AG Termopasty ART.AGT-108

AG Gold is a thermal paste with the addition of gold. It has an exceptionally high thermal conductivity (>2.8 W/mK), which is up to three times higher than most traditional products. 3g paste in a syringe. AG Termopasty ART.AGT-106

Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 1g in a syringe. AG Termopasty ART.AGT-162

AG Gold is a thermal paste with the addition of gold. It is characterized by high thermal conductivity (>2.8 W/mK), which is up to three times higher than in the case of introducing products. AG Termopasty ART.AGT-163

AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. A paste weighing 1g in a syringe. AG Termopasty ART.AGT-164

The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-116

Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-144

AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. 0.5g paste in a sachet. AG Termopasty ART.AGT-143

Heat Grease Thermal Grease based on copper with a thermal conductivity of approx. 3.1 W / mK. AG Termopasty ART.AGT-061

Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 1000g in a plastic box. AG Termopasty ART.AGT-150

Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 100g in a plastic box. AG Termopasty ART.AGT-247

AG Gold is a thermal paste with the addition of gold. It is characterized by high thermal conductivity (>2.8 W/mK), which is up to three times higher than in the case of introducing products. AG Termopasty ART.AGT-119

The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-180

AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. A paste weighing 1000 g in a plastic box. AG Termopasty ART.AGT-149