HPX thermal paste 60g, cartridge

Silicone thermal grease used to improve the amount of heat transferred to, for example, the heat sink. The paste is resistant to oxidation and operating temperature in the range from -50 to 200 ° C. Paste in a tube with a capacity of 7 g. AG Termopasty ART.AGT-055

The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-180

Foam with a density of 0.99 g/cm3 and a slightly alkaline pH (7-8) helps to find any gas or air leaks. AG Termopasty ART.AGT-133

AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. 0.5g paste in a sachet. AG Termopasty ART.AGT-143

Heat Grease Thermal Grease based on copper with a thermal conductivity of approx. 3.1 W / mK. AG Termopasty ART.AGT-060

HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-113

ART.AGT-324 Carbon thermal paste with a thermal conductivity of 15.2 W/mK effectively transfers heat from processors, graphics cards, and other components. Its stable and durable formula with carbon nanoparticles ensures high cooling performance and safe use in demanding systems.

HPX thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-114

Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 100g in a plastic box. AG Termopasty ART.AGT-247

Heat Grease Thermal Grease based on copper with a thermal conductivity of approx. 3.1 W / mK. AG Termopasty ART.AGT-061

Silicone thermal grease used to improve the amount of heat transferred to, for example, the heat sink. The paste is resistant to oxidation and operating temperature in the range from -50 to 200 ° C. Paste in a syringe with a capacity of 25 g. AG Termopasty ART.AGT-056

The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-116

Silicone thermal grease used to improve the amount of heat transferred to, for example, the heat sink. The paste is resistant to oxidation and operating temperature in the range from -50 to 200 ° C. Paste in a cartridge with a capacity of 400 g. AG Termopasty ART.AGT-311

HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-127

Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-057

Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 1000g in a plastic box. AG Termopasty ART.AGT-150