

zł2,098.25 tax excl.
Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 1000g in a plastic box. AG Termopasty ART.AGT-150
AG Extreme paste enables excellent heat conduction between elements such as: heat sink and fan, CPU, GPU. The substance is a dielectric (not an electrical conductor), which provides protection against various electrical hazards. The method of application ensures simplicity of use, and the product can be easily applied to various elements of computer equipment, LEDs. Application: fills micro unevenness between touching elements, e.g. processor and radiator, heat transfer from the condenser of the heat pipe to the exchanger in the vacuum solar collector, LED diodes.
Manufacturer AG TermoPasty Grzegorz Gąsowski Kolejowa 33E 18-218 Sokoły Poland info@termopasty.pl
Responsible person AG TermoPasty Grzegorz Gąsowski Kolejowa 33E 18-218 Sokoły Poland info@termopasty.pl
Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-120
No product available!
AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. 0.5g paste in a sachet. AG Termopasty ART.AGT-143
The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-180
HPX thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-126
Foam with a density of 0.99 g/cm3 and a slightly alkaline pH (7-8) helps to find any gas or air leaks. AG Termopasty ART.AGT-133
Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-059
No product available!
Silicone thermal paste used to improve the amount of heat transferred to, for example, a radiator. The paste is resistant to oxidation and operating temperatures ranging from -50 to 200°C. Paste in a cartridge with a capacity of 800 g. AG Termopasty ART.AGT-309
Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-144
Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-057
AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. 3g paste in a syringe. AG Termopasty ART.AGT-107
HPX thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-114
No product available!
AG Gold is a thermal paste with the addition of gold. It is characterized by high thermal conductivity (>2.8 W/mK), which is up to three times higher than in the case of introducing products. AG Termopasty ART.AGT-163
Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 1g in a syringe. AG Termopasty ART.AGT-162
HPX thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-275
The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-116
HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-284
Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 1000g in a plastic box. AG Termopasty ART.AGT-150