HPX thermal paste 7g, tube

AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. A paste weighing 100 g in a plastic box. AG Termopasty ART.AGT-118

HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-113

Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 1000g in a plastic box. AG Termopasty ART.AGT-150

Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-144

AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. 3g paste in a syringe. AG Termopasty ART.AGT-107

Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-059

Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). 3g paste in a syringe. AG Termopasty ART.AGT-108

ART.AGT-325 Carbon thermal paste with a thermal conductivity of 15.2 W/mK effectively transfers heat from processors, graphics cards, and other components. Its stable and durable formula with carbon nanoparticles ensures high cooling performance and safe use in demanding systems.

Heat Grease Thermal Grease based on copper with a thermal conductivity of approx. 3.1 W / mK. AG Termopasty ART.AGT-061

ART.AGT-324 Carbon thermal paste with a thermal conductivity of 15.2 W/mK effectively transfers heat from processors, graphics cards, and other components. Its stable and durable formula with carbon nanoparticles ensures high cooling performance and safe use in demanding systems.

HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-284

Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 1g in a syringe. AG Termopasty ART.AGT-162

HPX thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-114

Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-058

AG Gold is a thermal paste with the addition of gold. It has an exceptionally high thermal conductivity (>2.8 W/mK), which is up to three times higher than most traditional products. 3g paste in a syringe. AG Termopasty ART.AGT-106

Silicone thermal paste used to improve the amount of heat transferred to, for example, a radiator. The paste is resistant to oxidation and operating temperatures ranging from -50 to 200°C. Paste in a cartridge with a capacity of 800 g. AG Termopasty ART.AGT-309