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New products
New products
zł11.09 tax excl.
AG Gold is a thermal paste with the addition of gold. It has an exceptionally high thermal conductivity (>2.8 W/mK), which is up to three times higher than most traditional products. 3g paste in a syringe. AG Termopasty ART.AGT-106
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Description
AG Gold is a thermal paste with the addition of gold. It has an exceptionally high thermal conductivity (>2.8 W/mK), which is up to three times higher than most traditional products. It enables a significant reduction of the processor temperature (to about 6°C) without the need to replace the heatsink, which is a useful feature especially for people who decide to overclock. AG Gold paste can be placed on the CPU, GPU, RAM module or other component.
Features
- Thermoconductive paste gold
- Thermal conductivity:> 2.8 W / mk
- Thermal impedance: <0.095 ° C in2 / W
- Specific weight:> 2.5 g / cm3
- Pairing: <0.001
- Leakage: <0.05
- Dielectric constant:> 5.1
- Working temperature: -30~300 °C
- Thermal resistance: -50~340°C
- Packaging: syringe
- Weight: 3 g
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HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-113
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Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-057
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AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. A paste weighing 1000 g in a plastic box. AG Termopasty ART.AGT-146
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