zł5.89 tax excl.
Thermal paste with gold particles, designed to fill microscopic surface irregularities between components requiring efficient heat transfer, including processors, electronic components and heatsinks. Thermal conductivity is >3.57 W/mK, with an operating temperature range from -50°C to 250°C and short-term temperature resistance up to 340°C. The paste provides good dielectric properties and can also be used in industrial equipment and energy systems. The ART.AGT-163 variant is supplied in a syringe containing 1 g of paste. AG TermoPasty ART.AGT-163
Thermal paste with gold particles, designed to fill microscopic surface irregularities between components requiring efficient heat transfer, including processors, electronic components and heatsinks. Thermal conductivity is >3.57 W/mK, with an operating temperature range from -50°C to 250°C and short-term temperature resistance up to 340°C. The paste provides good dielectric properties and can also be used in industrial equipment and energy systems. The ART.AGT-163 variant is supplied in a syringe containing 1 g of paste.
Manufacturer
Responsible person
Heat Grease Thermal Grease based on copper with a thermal conductivity of approx. 3.1 W / mK. AG Termopasty ART.AGT-060
AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. 3g paste in a syringe. AG Termopasty ART.AGT-107
Thermal paste with gold particles, designed to fill microscopic surface irregularities between components requiring efficient heat transfer, including processors, electronic components and heatsinks. Thermal conductivity is >3.57 W/mK, with an operating temperature range from -50°C to 250°C and short-term temperature resistance up to 340°C. The paste provides good dielectric properties and can also be used in industrial equipment and energy systems. The ART.AGT-106 variant is supplied in a syringe containing 3 g of paste. AG TermoPasty ART.AGT-106
AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. 0.5g paste in a sachet. AG Termopasty ART.AGT-143
Thermal paste with gold particles, designed to fill microscopic surface irregularities between components requiring efficient heat transfer, including processors, electronic components and heatsinks. Thermal conductivity is >3.57 W/mK, with an operating temperature range from -50°C to 250°C and short-term temperature resistance up to 340°C. The paste provides good dielectric properties and can also be used in industrial equipment and energy systems. The ART.AGT-119 variant is supplied in a plastic container holding 100 g of paste. AG TermoPasty ART.AGT-119
Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 1000g in a plastic box. AG Termopasty ART.AGT-150
No product available!
Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 100g in a plastic box. AG Termopasty ART.AGT-247
Thermal paste with gold particles, designed to fill microscopic surface irregularities between components requiring efficient heat transfer, including processors, electronic components and heatsinks. Thermal conductivity is >3.57 W/mK, with an operating temperature range from -50°C to 250°C and short-term temperature resistance up to 340°C. The paste provides good dielectric properties and can also be used in industrial equipment and energy systems. The ART.AGT-119 variant is supplied in a plastic container holding 100 g of paste. AG TermoPasty ART.AGT-119
The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-180
No product available!
AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. A paste weighing 100 g in a plastic box. AG Termopasty ART.AGT-118
Foam with a density of 0.99 g/cm3 and a slightly alkaline pH (7-8) helps to find any gas or air leaks. AG Termopasty ART.AGT-133
HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-127
HPX thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-114
No product available!
N silicone paste with a density of 1.02-1.04 g/cm3 is a product characterized by protective properties. It preserves rubber in particular, as well as plastics, preventing punctures. AG Termopasty ART.AGT-054
No product available!
Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-058
Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-059
No product available!
Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-120
No product available!
HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-113
No product available!
HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-125
HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-284
HPX thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-128
Thermal paste with gold particles, designed to fill microscopic surface irregularities between components requiring efficient heat transfer, including processors, electronic components and heatsinks. Thermal conductivity is >3.57 W/mK, with an operating temperature range from -50°C to 250°C and short-term temperature resistance up to 340°C. The paste provides good dielectric properties and can also be used in industrial equipment and energy systems. The ART.AGT-163 variant is supplied in a syringe containing 1 g of paste. AG TermoPasty ART.AGT-163