Thermal glue AG TermoGlue 10g

AG Gold is a thermal paste with the addition of gold. It has an exceptionally high thermal conductivity (>2.8 W/mK), which is up to three times higher than most traditional products. 3g paste in a syringe. AG Termopasty ART.AGT-106

Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-057

AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. 0.5g paste in a sachet. AG Termopasty ART.AGT-143

AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. A paste weighing 1g in a syringe. AG Termopasty ART.AGT-164

AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. A paste weighing 1000 g in a plastic box. AG Termopasty ART.AGT-118

AG Gold is a thermal paste with the addition of gold. It is characterized by high thermal conductivity (>2.8 W/mK), which is up to three times higher than in the case of introducing products. AG Termopasty ART.AGT-119

Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-144

BLOW thermal paste with a conductivity of 12.5 W/m·K in a 4 g package is a high-performance heat-conducting material, ideal for use in computers and electronic devices. It provides excellent heat dissipation efficiency, is non-conductive electrically, and does not require special application conditions. The included syringe and spatula allow for precise and clean application of the product.

Heat Grease Thermal Grease based on copper with a thermal conductivity of approx. 3.1 W / mK. AG Termopasty ART.AGT-060

N silicone paste with a density of 1.02-1.04 g/cm3 is a product characterized by protective properties. It preserves rubber in particular, as well as plastics, preventing punctures. AG Termopasty ART.AGT-054

The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-180

Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). 3g paste in a syringe. AG Termopasty ART.AGT-108

HPX thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-128

Silicone thermal grease used to improve the amount of heat transferred to, for example, the heat sink. The paste is resistant to oxidation and operating temperature in the range from -50 to 200 ° C. Paste in a cartridge with a capacity of 400 g. AG Termopasty ART.AGT-311

HPX thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-126

Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 100g in a plastic box. AG Termopasty ART.AGT-247