Thermal glue AG TermoGlue 10g
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  • Thermal glue AG TermoGlue 10g
ID: 551083
5901764327097
zł9.46
Tax included

zł7.69 tax excl.

The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-116

24h
Available
Available quantity: 370
 

Free shipping

free shipping in Poland for all orders over 500 PLN

 

Same day shipping

If your payment will be credited to our account by 11:00

 

14 days for return

Each consumer can return the purchased goods within 14 days

Description

AG TermoGlue thermally conductive adhesive is used to fix heat sinks located, among others, in on memory chips, transistors or bridges. It's a great way to create lasting connections. Thanks to the use of glue, excellent heat conduction parameters are obtained. Another application is connecting and filling gaps between heating elements. It is worth remembering not to exceed the maximum thickness, which is 6 mm. It took about 24 hours for the white thermally conductive adhesive to dry.

properties

  • Heat-conducting glue
  • White color
  • Thermal conductivity: 1 W / mK
  • Maximum working temperature: 200 ° C
  • Electrical puncture resistance: min. 20 kV / mm
  • Tensile strength: 2 MPa
  • Dielectric constant: 3
  • Drying time: 8 minutes
  • Weight: 10 g (net)
551083

Data sheet

Capacity
10 g
Type of packaging
Tube
Dispenser type
Cap

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