Thermal glue AG TermoGlue 10g

HPX thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-275

Heat Grease Thermal Grease based on copper with a thermal conductivity of approx. 3.1 W / mK. AG Termopasty ART.AGT-060

Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-058

HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-113

AG Gold is a thermal paste with the addition of gold. It is characterized by high thermal conductivity (>2.8 W/mK), which is up to three times higher than in the case of introducing products. AG Termopasty ART.AGT-119

Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-144

AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. A paste weighing 1000 g in a plastic box. AG Termopasty ART.AGT-149

AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. 3g paste in a syringe. AG Termopasty ART.AGT-107

BLOW thermal paste with a conductivity of 12.5 W/m·K in a 4 g package is a high-performance heat-conducting material, ideal for use in computers and electronic devices. It provides excellent heat dissipation efficiency, is non-conductive electrically, and does not require special application conditions. The included syringe and spatula allow for precise and clean application of the product.

HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-284

HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-127

The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-180

HPX thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-128

Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-059

Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-057

HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-125