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Silicone thermal paste with 1.5 W/mK thermal conductivity for improving heat dissipation in electronic components, electrically insulating, resistant to moisture and chemicals, 500 g cartridge. AG TermoPasty ART.AGT-327
HP silicone thermal conductive paste used to improve heat transfer between electronic components and heatsinks or cooling surfaces. Thermal conductivity of 1.5 W/mK enables effective heat dissipation in systems operating under elevated temperatures, such as LED modules, power supplies, processors and power components. The product is electrically insulating, allowing safe use in circuits requiring electrical isolation.
Operating temperature range from -50°C to 250°C and resistance to moisture, oxidation and chemical agents enable use in industrial and service environments. The paste consistency allows even distribution of a thin layer, while the 500 g cartridge enables manual application or use with a dispensing gun, suitable for production and intensive use.
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Thermal paste with gold particles, designed to fill microscopic surface irregularities between components requiring efficient heat transfer, including processors, electronic components and heatsinks. Thermal conductivity is >3.57 W/mK, with an operating temperature range from -50°C to 250°C and short-term temperature resistance up to 340°C. The paste provides good dielectric properties and can also be used in industrial equipment and energy systems. The ART.AGT-119 variant is supplied in a plastic container holding 100 g of paste. AG TermoPasty ART.AGT-119
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No product available!
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Silicone thermal paste with 1.5 W/mK thermal conductivity for improving heat dissipation in electronic components, electrically insulating, resistant to moisture and chemicals, 500 g cartridge. AG TermoPasty ART.AGT-327