- Out-of-Stock
Jean Labrosse, Jack Ganssle, Robert Oshana, Colin Walls, Keith E. Curtis, Jason Andrews, David Katz, Rick Gentile, Kamal Hyder, Bob Perrin
The Newnes Know It All Series has to create a hard-working engineer, design and rules of thumb. Guaranteed not to gather dust on a shelf!
Embedded software is present everywhere - from a garage door opener to implanted medical devices is a multicore computer system. This book covers the development and testing of different languages. Optimization of code, and the testing of that code, are detailed to enable readers to create the best solutions on-time and on-budget. Bringing together the experts in the field.
Chapter 1: Basic Embedded Programming Concepts
Chapter 2: Device Drivers
Chapter 3: Embedded Operating Systems
Chapter 4: Networking
Chapter 5: Error Handling and Debugging
Chapter 6: Hardware / Software Co-Verification
Chapter 7: Techniques for Embedded Media Processing
Chapter 8: DSP in Embedded Systems
Chapter 9: Practical Embedded Coding Techniques
Chapter 10: Development Technologies and Trends
* Proven, real-world advice and guidance from such "name" authors as Tammy Noergard, Jen LaBrosse, and Keith Curtis
* Popular architectures and languages fully discussed
* Gives a comprehensive, detailed overview of techniques and methodologies for developing effective, efficient embedded software
Chapter 1: Basic Embedded Programming Concepts
Chapter 2: Device Drivers
Chapter 3: Embedded Operating Systems
Chapter 4: Networking
Chapter 5: Error Handling and Debugging
Chapter 6: Hardware / Software Co-Verification
Chapter 7: Techniques for Embedded Media Processing
Chapter 8: DSP in Embedded Systems
Chapter 9: Practical Embedded Coding Techniques
Chapter 10: Development Technologies and Trends
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Romeo family evaluation kit with Bluetooth 4.0 module. It is based on the STM32F103RET6 microcontroller and has a built-in four-channel DC motor driver. DFRobot DFR0398
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Camera with a resolution of 2 MPx with a USB interface. Equipped with CMOS IMX291 sensor with 86° lens, microphone, housing and tripod. ArduCAM B0354
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Heat sink dedicated to the NanoPi NEO minicomputers. Comes with thermopad. FriendlyELEC NanoPi NEO Heat Sink
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ROSA3D filament made of high-quality PLA granules. 0.8 kg of filament with a diameter of 1.75 mm is wound on the spool. ROSA3D PLA Starter Green
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A stand that uses the phenomenon of magnetic levitation. It can lift objects weighing up to 500 g. Power via USB with 5V
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Jean Labrosse, Jack Ganssle, Robert Oshana, Colin Walls, Keith E. Curtis, Jason Andrews, David Katz, Rick Gentile, Kamal Hyder, Bob Perrin