Assembly in electronics

About the book

The dynamic development of the functionality of electronic devices is possible thanks to the achievements of technology for the production of electronic components and information technology. However, the functional electronic device arises when the system of connections between the elements corresponds to the designed electrical scheme, so the implementation and effective functioning of the electronic device depends, among other things, on the correct implementation of electrical connections at the level of the semiconductor structure, between the semiconductor structure elements and its housing leads, pin connections components in electronic systems, systems in assemblies, and those in complete devices. For this purpose, intermediate elements (e.g. housings, printed circuit boards), special materials and technologies are usually used. These issues have become the subject of the book Montage in Electronics.
The assembly in electronics includes a broad knowledge of inseparable connections (including soldered, welded, glued) and disjointed, and the purpose of the book is to provide basic information about these issues. The connection techniques and materials used are very different, which results from the "hierarchy" of assembly levels. To understand the techniques of joining, it is necessary to know about the pins / contacts of components, housings used by the electronics industry, printed circuit boards and design principles for the field of mosaic brazing on these plates, as well as knowledge of exposures and heat dissipation methods.The information contained in the book should also enable independent design of assemblies taking into account the assembly principles.

Table of Contents

1. Introduction
2. Mounting levels and technologies
3. Wire installation
4. Installation of the chip php

5. Elements, housing, architecture of leads
5.1. Active and passive elements for through-hole assembly
5.2. Passive elements for surface mounting
5.3. Housings of integrated circuits

6. Substrates. Printed circuit boards
6.1. Types of substrates
62. Manufacture of printed circuit boards
6.3. Multilayer tiles
6.4. Contact coatings
6.5. Designing a mosaic of paths and contact fields

7. Basics of the soldering process, soldering alloys and pastes
7.1. Soldering
7.2. Unleaded assembly
7.3. Wetting
7.4. Capillary processes
7.5. Diffusion processes
7.6. Intermetallic compounds
7.7. Unleaded soldering alloys
7.8. Fluxes and their role in creating a soldered connection
7.9. Soldering pastes

8. Soldering technologies
8.1. Soldering techniques depending on the construction of the assembly
8.2. Manual soldering
8.3. Wave soldering
8.4. Reflow soldering

9. Defects of soldered connections
9.1. Non-wetted
9.2. Soldering defects in through-hole assembly
9.3. Disadvantages of soldering in surface mounting
9.4. Disadvantages of soldered connections made with the flip chip technique
9.5. Defects specific to lead-free solders
9.6. Methods for quality control of soldered connections

10. Washing after the soldering process
10.1. Pollution
10.2. The effects of pollution
10.3. Washing and cleaning agents
10.4. Checking cleanliness

11. Adhesives and glueing
11.1. Structural adhesives
11.2. Electrical conductive adhesives
11.3. Heat-conductive adhesives
11.4. Methods of dispensing glue

12. Connections and connectors
12.1. Separable connections
12.2. Permanent connections
12.3. Wires and cables

13. Environmental exposures, problems of heat dissipation
13.1. Reliability in electronic assembly
13.2. Environmental exposures
13.3. Mechanical exposure
13.4. Thermal exposures
13.5. Heat dissipation
13.6. Cooling
Literature