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Thermoconductive tapes are used where it is not possible to use a thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to the elements that require cooling. Used on graphic card heat sinks, its task is to enable transfer of heat from memory or power section to it.
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The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-116
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AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-134
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Low-cost development board based on the Xilinx Zynq®-7000 All Programmable SoC, RoHS
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Arduino compatible eval-board based on Analog Devices ADuCM360/361 microcontroller
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Thermopad, two-side thermo-adhesive tape, 20mm x 130mm x 1mm, 6W / mK, AG Thermopiles, RoHS