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New products
New products
zł340.68 tax excl.
No Clean paste for soldering SMD components, containing a resin and solvent-based flux and thixotropic additives, retains its physicochemical properties for 20 hours on a PCB board, does not contain chlorides, and the flux residue does not corrode and does not require washing, ensuring good properties of soldered joints mechanical and electrical. ART.AGT-027
Free shipping
free shipping in Poland for all orders over 500 PLN
Same day shipping
If your payment will be credited to our account by 11:00
14 days for return
Each consumer can return the purchased goods within 14 days
Description
No Clean paste intended for soldering SMD components in processes that do not include washing phases. In addition to metal powder, the product contains a flux based on resin and solvent, oxide-removing activators and thixotropic additives responsible for viscosity and plasticity. The paste does not lose its physicochemical properties even after 20 hours of being left on the PCB. This time depends on the conditions in the room: humidity and temperature.
Additional properties
- does not contain chlorides
- the flux residue does not corrode and does not require washing
- soldered connections have good mechanical and electrical properties
Other products in the same category (16)
Alpha SAC305 Omnix 338 is a high-quality rosin gel flux designed for lead-free BGA soldering, providing excellent component adhesion. The product is halogen-free (ROL0), which minimizes corrosion and ensures clean connections in accordance with RoHS standards.
Solder paste used in the SMD soldering process. It is suitable for both automatic soldering and manual printers. ThermoPasts ART.AGT-032
No product available!
Cynel EVO-TF gel flux is a high-performance product that can be successfully used in professional electronics services and hobby workshops. Thanks to its specification and gel form, this flux offers not only high work efficiency, but also excellent properties in the protection and maintenance of soldering tips.
Soldering paste medium-active flux with the consistency of a paste based on rosin and organic halogen activator, facilitating the soldering of copper, silver, zinc and nickel elements. AG Termopasty ART.AGT-037
Solder paste used in the SMD soldering process. It is suitable for both automatic soldering and manual printers. ThermoPasts ART.AGT-026
No product available!
Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 1000 ml bottle. AG Thermopasty ART.AGT-083
High quality and clean medium active flux that facilitates precise soldering. Perfectly moisturizes and cleanses soldered surfaces and protects them against oxidation. MICRO CHIP ELECTRONIC ART.056
Rosin flux in a 50 ml plastic bottle with a brush. AG Termopasty ART.AGT-248
Soldering rosin with the addition of activators, thanks to which it has an activity similar to solder paste. 500 g package. AG Termopasty ART.AGT-268
Flux TK83 is an alcohol solution for soldering with the addition of organic activators. AG Termopasty ART.AGT-045
Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 100 ml bottle. AG Thermopasty ART.AGT-046
The fluid is intended for soft soldering of galvanized sheets and pure zinc. 50 ml bottle. AG Termopasty ART.AGT-204
AG 50 soldering acid with a brush. The product is intended for soldering of nickel plated surfaces. AG Termopasty ART.AGT-319
Flux TK83 is an alcohol solution for soldering with the addition of organic activators. AG Termopasty ART.AGT-044
Kester 951 is a halogen-free, chlorophyll Flux Pen® applicator, specially designed for surface soldering.
No product available!
Rosin for soldering with addition of activators, thanks to which this rosin has activity similar to solder paste. The packaging contains 40g of flux. AG Termopasty ART.AGT-034