Easy Print /Sn96,5 Ag3 Cu0,5/500g plastic box
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  • Easy Print /Sn96,5 Ag3 Cu0,5/500g plastic box
ID: 584393
zł235.73
Tax included

zł191.65 tax excl.

Solder paste used in the SMD soldering process. It is suitable for both automatic soldering and manual printers. ThermoPasts ART.AGT-026

2 weeks
On request

 

Free shipping

free shipping in Poland for all orders over 500 PLN

 

Same day shipping

If your payment will be credited to our account by 11:00

 

14 days for return

Each consumer can return the purchased goods within 14 days

Description

Solder paste used in the SMD soldering process. It is suitable for both automatic soldering and manual printers. It has excellent adhesion even for 24 hours after application. Thanks to its unique properties, this paste minimizes the phenomenon of mid chip solderballing, enabling the creation of high-quality mechanical and electrical connections. The product has been designed to prevent moisture condensation, which can be achieved by bringing the paste to ambient temperature before opening, ensuring that its properties remain in optimal condition.

The paste is based on No Clean flux technology, which eliminates the need for washing. The residues left after paste soldering are minimal, colorless and non-corrosive, which greatly facilitates the testing process.

Features

  • Type of binder: Sn96.5Ag3Cu0.5
  • Flux classification: REL
  • Density ≈ 4.6 g/cm3
  • Grain size: 25-45 μm
  • Stickiness: 1.0 G/mm2
  • Shelf life for printing: over 8 hours
  • Packaging: plastic box
  • Capacity: 250 g

584393

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