Flux gel 10ml cartridge AG

Flux gel is a thickened rosin flux class RMA designed for SMT assembly and repairs. AG Termopasty ART.AGT-088

Soldering rosin with the addition of activators. Made of pine resin, it prevents oxidation of joints and eliminates the formation of cold solders. The package contains 45 g of flux

AG 50 soldering acid with a brush. The product is intended for soldering of nickel plated surfaces. AG Termopasty ART.AGT-319

Soldering paste medium-active flux with the consistency of a paste based on rosin and organic halogen activator, facilitating the soldering of copper, silver, zinc and nickel elements. AG Termopasty ART.AGT-038

Kester 951 is a halogen-free, chlorophyll Flux Pen® applicator, specially designed for surface soldering.

Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 100 ml bottle. AG Thermopasty ART.AGT-046

Soldering rosin with the addition of activators, thanks to which it has an activity similar to solder paste. 500 g package. AG Termopasty ART.AGT-268

No Clean paste for soldering SMD components, containing a resin and solvent-based flux and thixotropic additives, retains its physicochemical properties for 20 hours on a PCB board, does not contain chlorides, and the flux residue does not corrode and does not require washing, ensuring good properties of soldered joints mechanical and electrical. ART.AGT-031

Rosin for soldering with addition of activators, thanks to which this rosin has activity similar to solder paste. The packaging contains 20g of flux. AG Termopasty ART.AGT-033

The fluid is intended for soft soldering of galvanized sheets and pure zinc. 50 ml bottle. AG Termopasty ART.AGT-204

A rosin-free, liquid flux intended for the application of the liquid Sn60/Pb alloy on printed circuit boards in tinplate rollers. 100 ml bottle. AG Termopasty ART.AGT-110

Gel flux is a thickened RMA class rosin flux intended for SMT assembly and repairs. AG Termopasty ART.AGT-089

Rosin flux in a 1000 ml plastic bottle. AG Termopasty ART.AGT-043

A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 1000 ml bottle. AG Termopasty ART.AGT-074

Soldering acid intended for hard-to-solder nickel-plated surfaces. 500 ml bottle. AG Termopasty ART.AGT-272

No Clean paste for soldering SMD components, containing a resin and solvent-based flux and thixotropic additives, retains its physicochemical properties for 20 hours on a PCB board, does not contain chlorides, and the flux residue does not corrode and does not require washing, ensuring good properties of soldered joints mechanical and electrical. ART.AGT-027