Soldering paste medium-active flux with the consistency of a paste based on rosin and organic halogen activator, facilitating the soldering of copper, silver, zinc and nickel elements. AG Termopasty ART.AGT-037
Flux gel is a thickened rosin flux class RMA designed for SMT assembly and repairs. AG Termopasty ART.AGT-047
Rosin flux intended for assembly and repair of SMD and BGA components. Cartridge with a capacity of 10 g. Alpha OM-338
Gel flux is a thickened RMA class rosin flux intended for SMT assembly and repairs. AG Termopasty ART.AGT-089
Gel rosin flux designed for assembly and repair of THT and SMT components. Cartridge with a capacity of 10 ml. RMA-223
Paste flux intended for soft soldering of metals. 40 ml package. AG Termopasty ART.AGT-203
Flux gel is a thickened rosin flux class RMA designed for SMT assembly and repairs. AG Termopasty ART.AGT-088
Broquetas BRFP-260-10 is a rosin-free paste flux, class REL0, in a 10 ml syringe, intended for precise electronics soldering. Thanks to its halogen-free formula and convenient application, it is suitable for electronic device servicing and SMD assembly
Soldering paste medium-active flux with the consistency of a paste based on rosin and organic halogen activator, facilitating the soldering of copper, silver, zinc and nickel elements. AG Termopasty ART.AGT-038
Rosin flux intended for assembly and repair of SMT components. Dispenser with a capacity of 10 g. Alpha RMA 7
Soldering paste in a metal box with a capacity of 20 g. Facilitates soldering of electronic components. AG Termopasty ART.AGT-036
Thickened rosin flux intended for SMT assembly and repair. In a 10 ml cartridge. AG Termopasty ART.AGT-179
Flux BTFO‑81‑1H in a 10 ml syringe, intended for precise electronics soldering. Halogen-free formula ensures clean residues and high reliability of solder joints.
Flux intended for soldering and welding with brass solders. Dissolves metal oxides and facilitates the bonding of solder to the material. AG Borax ART. AGT-121
Broquetas BTFO-81-2H flux in gel form, 10 ml, is an effective tool for precise manual soldering of electronic components. Its halogenated ROM1 formula provides good wettability and high-quality solder joints, especially in applications requiring cleanliness and durability. Ideal for repair work and manual assembly in precision electronics.
Alpha SAC305 Omnix 338 is a high-quality rosin gel flux designed for lead-free BGA soldering, providing excellent component adhesion. The product is halogen-free (ROL0), which minimizes corrosion and ensures clean connections in accordance with RoHS standards.