

zł6.15 tax excl.
Flux TK 83 50ml AG with brush enables precise SMD and BGA assembly, soldering of electronic components, and tinning wire ends in electronics and robotics. The product is recommended for service applications and device assembly, as well as workshop tasks requiring high-quality solder joints and easy dosing of the flux. Residues can remain on PCBs, but for complete cleanliness, their removal with isopropyl alcohol is advised. AG Termopasty ART.AGT-044
Flux TK 83 50ml AG with brush is an alcohol-based rosin solution with organic activators, designed for high-quality soldering connections in electronics. The TK83 flux enables mounting SMD and BGA components as well as tinning wire ends, performing effectively in both manual and machine assembly. The practical brush applicator allows precise application of the liquid to soldered surfaces, which is especially important when soldering SMD components and during mixed assembly of electronic circuits. The recommended soldering temperature is up to 280°C, allowing safe soldering of most components used in electronics and robotics. This product is dedicated to assembly and servicing of electronic devices, SMD and BGA soldering, and mounting components on PCBs.
Before soldering, apply a small amount of TK83 flux to the chosen surface using the integrated brush. The preparation should be spread evenly, ensuring thorough coverage of soldering points, particularly when mounting SMD and BGA components or tinning wire ends. After soldering, flux residues are non-corrosive and may remain on the PCB. However, for high cleanliness requirements or for subsequent assembly stages, it is recommended to clean them with isopropyl or ethyl alcohol, or a dedicated PCB cleaner. Use a soft brush or antistatic cloth for cleaning.
Manufacturer AG TermoPasty Grzegorz Gąsowski Kolejowa 33E 18-218 Sokoły Poland info@termopasty.pl
Responsible person AG TermoPasty Grzegorz Gąsowski Kolejowa 33E 18-218 Sokoły Poland info@termopasty.pl
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Flux TK 83 50ml AG with brush enables precise SMD and BGA assembly, soldering of electronic components, and tinning wire ends in electronics and robotics. The product is recommended for service applications and device assembly, as well as workshop tasks requiring high-quality solder joints and easy dosing of the flux. Residues can remain on PCBs, but for complete cleanliness, their removal with isopropyl alcohol is advised. AG Termopasty ART.AGT-044