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Tin Cynel Sn99.3Cu0.7 with flux 1.1.3 0.50mm 100g
ID: 560331
5906623405213
zł36.86
Tax included
zł29.97 tax excl.
Lead-free Sn99.3Cu0.7 1.1.3 solder wire, manufactured in accordance with the EN ISO 9453:2014 standard, combines rosin, halide-free 1.1.3 flux with high-quality binder, meeting the requirements of the RoHS2 directive and guaranteeing performance in electronics and electrical engineering
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Description
The lead-free solder wire Sn99.3Cu0.7 1.1.3 is a perfect solution for everyone who needs an efficient solder in the field of electronics and electrical engineering. Thanks to the precise production process in the first smelting of tin and copper, in accordance with the EN ISO 9453:2014 standard, this product guarantees high quality and effectiveness. It is a lead-free, low-activity product based on rosin flux 1.1.3, which is halide-free, which makes it meet the requirements of the RoHS2 directive.
The composition of the alloy is dominated by tin (the rest), with the addition of copper in the range of 0.5 - 0.9%. Traces of other elements are kept to a minimum, ensuring the purity of the product. The product has a melting point of 227°C, a specific gravity of 7.31 g/cm3, and a resistivity of 0.126 μΩ*m. The recommended temperature of the soldering tip is from 340 to 420°C.
Alloy composition [%]
| Sn | Cu | Bi | Sb | Ag | Cd | Au | In | Pb | Al | As | Fe | Ni | Zn |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| rest | 0,5 - 0,9 | max 0,1 | max 0,1 | max 0,1 | max 0,002 | max 0,05 | max 0,1 | max 0,07 | max 0,001 | max 0,03 | max 0,02 | max 0,01 | max 0,001 |
Flux 1.1.3, the key component of this wire, has the markings SW32 according to DIN 8511, 1.1.3B according to ISO 9454 and ROM0 according to J-STD-004. Contains 3.0% ± 0.2% flux, with a total halide content of 0.0%. With an acid number of 195 ± 10 mg KOH/g and its non-corrosive properties, this flux is an ideal choice for those who need a reliable and efficient solder filler metal.
Features
- Melting point: 227°C
- Specific gravity: 7.31 g/cm3
- Resistivity: 0.126 μΩ*m
- Thermal conductivity: 66 W/m*K
- Tensile strength at break: 300 kgf/cm2
- Elongation at break: 21%
- Hardness: 9 HB
- Recommended tip temperature for soldering: 340 - 420°C
- Flux designation according to DIN 8511: SW32
- Flux designation according to ISO 9454: 1.1.3B
- Flux designation according to J-STD-004: ROM0
- Flux content in the binder: 3.0 +/- 0.2%
- Halide content: 0.0%
- Acid number: 195 ± 10 mg KOH/g
- Corrosivity: non-corrosive
560331
Data sheet
- Alloy
- Sn99,3Cu0,7
- Diameter
- 0,50 mm
- Weight
- 100 g
- Flux
- 1.1.3
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