Soldering Flux 500ml

Aerosol varnish to protect printed circuit boards against oxidation. AG Termopasty ART.AGT-235

RF800 flux is a medium-active rosin solution that does not require washing. AG Termopasty ART.AGT-042

Liquid, rosin-free flux intended for high-temperature tinning and soldering of painted elements. 1000 ml bottle. AG Termopasty ART.AGT-072

Liquid, rosin-free flux intended for high-temperature tinning and soldering of painted elements. 500 ml bottle. AG Termopasty ART.AGT-071

The fluid is intended for soft soldering of galvanized sheets and pure zinc. 50 ml bottle. AG Termopasty ART.AGT-204

A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 1000 ml bottle. AG Termopasty ART.AGT-074

Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 1000 ml bottle. AG Thermopasty ART.AGT-083

A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 500 ml bottle. AG Termopasty ART.AGT-073

Kester 951 is a halogen-free, chlorophyll Flux Pen® applicator, specially designed for surface soldering.

Liquid flux in the form of a rosin solution with the addition of organic activators, in a bottle with a capacity of 1000 ml. AG Termopasty ART.AGT-076

A rosin-free, liquid flux intended for the application of the liquid Sn60/Pb alloy on printed circuit boards in tinplate rollers. 100 ml bottle. AG Termopasty ART.AGT-110

Flux TK83 is an alcohol solution for soldering with the addition of organic activators. AG Termopasty ART.AGT-045

Rosin flux in a 50 ml plastic bottle with a brush. AG Termopasty ART.AGT-248

Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 100 ml bottle. AG Thermopasty ART.AGT-046

Flux TK 83 50ml AG with brush enables precise SMD and BGA assembly, soldering of electronic components, and tinning wire ends in electronics and robotics. The product is recommended for service applications and device assembly, as well as workshop tasks requiring high-quality solder joints and easy dosing of the flux. Residues can remain on PCBs, but for complete cleanliness, their removal with isopropyl alcohol is advised. AG Termopasty ART.AGT-044

Liquid flux in the form of a rosin solution with the addition of organic activators, in a 10 ml marker. Kester 186