Easy Print /Sn96,5 Ag3 Cu0,5/500g plastic box

Liquid flux in the form of a rosin solution with the addition of organic activators, in a bottle with a capacity of 500 ml. AG Termopasty ART.AGT-075

Liquid, rosin-free flux intended for high-temperature tinning and soldering of painted elements. 1000 ml bottle. AG Termopasty ART.AGT-072

Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 500 ml bottle. AG Thermopasty ART.AGT-082

High quality and clean medium active flux that facilitates precise soldering. Perfectly moisturizes and cleanses soldered surfaces and protects them against oxidation. MICRO CHIP ELECTRONIC  ART.058

Soldering acid intended for hard-to-solder nickel-plated surfaces. 1000 ml bottle. AG Termopasty ART.AGT-271

Rosin flux intended for assembly and repair of SMD and BGA components. Cartridge with a capacity of 10 g. Alpha OM-338

Soldering paste in a metal box with a capacity of 20 g. Facilitates soldering of electronic components. AG Termopasty ART.AGT-036

Soldering rosin with the addition of activators, thanks to which it has an activity similar to solder paste. 500 g package. AG Termopasty ART.AGT-094

High quality and clean medium active flux that facilitates precise soldering. Perfectly moisturizes and cleanses soldered surfaces and protects them against oxidation. MICRO CHIP ELEKTRONIC ART.055

Soldering rosin with the addition of activators, thanks to which it has an activity similar to solder paste. 500 g package. AG Termopasty ART.AGT-268

Liquid flux in the form of a rosin solution with the addition of organic activators, in a 10 ml marker. Kester 186

RF800 flux is a medium-active rosin solution that does not require washing. AG Termopasty ART.AGT-042

Soldering acid intended for hard-to-solder nickel-plated surfaces. 500 ml bottle. AG Termopasty ART.AGT-272

The fluid is intended for soft soldering of galvanized sheets and pure zinc. 100 ml bottle. AG Termopasty ART.AGT-205

Flux intended for soldering and welding with brass solders. Dissolves metal oxides and facilitates the bonding of solder to the material. AG Borax ART. AGT-121

A rosin-free, liquid flux intended for the application of the liquid Sn60/Pb alloy on printed circuit boards in tinplate rollers. 100 ml bottle. AG Termopasty ART.AGT-110