Cynel soldering paste 40g, metal box

Soldering paste in a metal box with a capacity of 20 g. Facilitates soldering of electronic components. AG Termopasty ART.AGT-036

A rosin-free, liquid flux intended for the application of the liquid Sn60/Pb alloy on printed circuit boards in tinplate rollers. 100 ml bottle. AG Termopasty ART.AGT-110

Liquid, rosin-free flux intended for high-temperature tinning and soldering of painted elements. 500 ml bottle. AG Termopasty ART.AGT-071

Flux TK83 is an alcohol solution for soldering with the addition of organic activators. AG Termopasty ART.AGT-045

A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 1000 ml bottle. AG Termopasty ART.AGT-074

No Clean paste for soldering SMD components, containing a resin and solvent-based flux and thixotropic additives, retains its physicochemical properties for 20 hours on a PCB board, does not contain chlorides, and the flux residue does not corrode and does not require washing, ensuring good properties of soldered joints mechanical and electrical. ART.AGT-031

A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 500 ml bottle. AG Termopasty ART.AGT-073

Rosin for soldering with addition of activators, thanks to which this rosin has activity similar to solder paste. The packaging contains 100g of flux. AG Termopasty ART.AGT-035

High quality and clean medium active flux that facilitates precise soldering. Perfectly moisturizes and cleanses soldered surfaces and protects them against oxidation. MICRO CHIP ELEKTRONIC ART.055

AG 50 soldering acid with a brush. The product is intended for soldering of nickel plated surfaces. AG Termopasty ART.AGT-253

Soldering rosin with the addition of activators. Made of pine resin, it prevents oxidation of joints and eliminates the formation of cold solders. The package contains 45 g of flux

Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 100 ml bottle. AG Thermopasty ART.AGT-046

Alpha SAC305 Omnix 338 is a high-quality rosin gel flux designed for lead-free BGA soldering, providing excellent component adhesion. The product is halogen-free (ROL0), which minimizes corrosion and ensures clean connections in accordance with RoHS standards.

Thickened rosin flux intended for SMT assembly and repair. In a 10 ml cartridge. AG Termopasty ART.AGT-179

Rosin flux intended for assembly and repair of SMD and BGA components. Cartridge with a capacity of 10 g. Alpha OM-338

Soldering rosin with the addition of activators, thanks to which it has an activity similar to solder paste. 500 g package. AG Termopasty ART.AGT-268