![Cynel soldering paste 40g, metal box](https://kamami.pl/102750-large_default/cynel-soldering-paste-40g-metal-box.jpg)
![Cynel soldering paste 40g, metal box](https://kamami.pl/102750-large_default/cynel-soldering-paste-40g-metal-box.jpg)
zł3.00 tax excl.
This paste is an ideal choice for applications where reliable and effective soldering is required, exceeding the capabilities of traditional rosin.
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Soldering paste weighing 40g is a medium-active flux that significantly facilitates the process of soldering elements made of copper, silver, zinc and nickel. This product is mainly used in cases where rosin is insufficient.
Cynel-1/40g solder paste is used for:
Gel flux is a thickened RMA class rosin flux intended for SMT assembly and repairs. AG Termopasty ART.AGT-089
Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 100 ml bottle. AG Thermopasty ART.AGT-046
Thickened rosin flux intended for SMT assembly and repair. In a 10 ml cartridge. AG Termopasty ART.AGT-179
Kester 951 is a halogen-free, chlorophyll Flux Pen® applicator, specially designed for surface soldering.
Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 500 ml bottle. AG Thermopasty ART.AGT-082
Rosin for soldering with addition of activators, thanks to which this rosin has activity similar to solder paste. The packaging contains 100g of flux. AG Termopasty ART.AGT-035
Rosin flux in a 100 ml plastic bottle with a brush. AG Termopasty ART.AGT-109
A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 100 ml bottle. AG Termopasty ART.AGT-041
Liquid, rosin-free flux intended for high-temperature tinning and soldering of painted elements. 100 ml bottle. AG Termopasty ART.AGT-040
Soldering rosin with the addition of activators, thanks to which it has an activity similar to solder paste. 500 g package. AG Termopasty ART.AGT-268
Aerosol varnish to protect printed circuit boards against oxidation. AG Termopasty ART.AGT-235
A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 1000 ml bottle. AG Termopasty ART.AGT-074
Liquid, rosin-free flux intended for high-temperature tinning and soldering of painted elements. 500 ml bottle. AG Termopasty ART.AGT-071
Liquid flux in the form of a rosin solution with the addition of organic activators, in a 10 ml marker. Kester 186
A rosin-free, liquid flux intended for the application of the liquid Sn60/Pb alloy on printed circuit boards in tinplate rollers. 100 ml bottle. AG Termopasty ART.AGT-110
Soldering paste in a metal box with a capacity of 20 g. Facilitates soldering of electronic components. AG Termopasty ART.AGT-036
This paste is an ideal choice for applications where reliable and effective soldering is required, exceeding the capabilities of traditional rosin.