A rosin-free, liquid, highly active flux of the 2.1.2/3 A type is an aqueous solution of organic compounds. Designed for the application of the liquid Sn60 / Pb alloy on printed circuit boards in roll tinning machines.
Instructions for use
The flux should be applied to the printed circuit boards by rolling, flux wave or with a brush. Flux residues are corrosive and immediately after tinning, remove them thoroughly with warm water (approx. 50°C), and then with cold water, using the immersion method or spraying.
Manufacturer AG TermoPasty Grzegorz Gąsowski Kolejowa 33E 18-218 Sokoły Poland info@termopasty.pl
Responsible person AG TermoPasty Grzegorz Gąsowski Kolejowa 33E 18-218 Sokoły Poland info@termopasty.pl
Flux TK83 is an alcohol solution for soldering with the addition of organic activators. AG Termopasty ART.AGT-045
Rosin flux in a 100 ml plastic bottle with a brush. AG Termopasty ART.AGT-109
Gel flux is a thickened RMA class rosin flux intended for SMT assembly and repairs. AG Termopasty ART.AGT-089
Kester 951 is a halogen-free, chlorophyll Flux Pen® applicator, specially designed for surface soldering.
Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 500 ml bottle. AG Thermopasty ART.AGT-082
Liquid flux in the form of a rosin solution with the addition of organic activators, in a 10 ml marker. Kester 186
No product available!
Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 1000 ml bottle. AG Thermopasty ART.AGT-083
The fluid is intended for soft soldering of galvanized sheets and pure zinc. 100 ml bottle. AG Termopasty ART.AGT-205
A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 500 ml bottle. AG Termopasty ART.AGT-073
Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 50 ml bottle. AG Thermopasty ART.AGT-323
High quality and clean medium active flux that facilitates precise soldering. Perfectly moisturizes and cleanses soldered surfaces and protects them against oxidation. MICRO CHIP ELECTRONIC ART.057
Liquid flux in the form of a rosin solution with the addition of organic activators, in a bottle with a capacity of 1000 ml. AG Termopasty ART.AGT-076
Liquid, rosin-free flux intended for high-temperature tinning and soldering of painted elements. 100 ml bottle. AG Termopasty ART.AGT-040
High quality and clean medium active flux that facilitates precise soldering. Perfectly moisturizes and cleanses soldered surfaces and protects them against oxidation. MICRO CHIP ELEKTRONIC ART.055
Aerosol varnish to protect printed circuit boards against oxidation. AG Termopasty ART.AGT-235
Flux TK 83 50ml AG with brush enables precise SMD and BGA assembly, soldering of electronic components, and tinning wire ends in electronics and robotics. The product is recommended for service applications and device assembly, as well as workshop tasks requiring high-quality solder joints and easy dosing of the flux. Residues can remain on PCBs, but for complete cleanliness, their removal with isopropyl alcohol is advised. AG Termopasty ART.AGT-044
High quality and clean medium active flux that facilitates precise soldering. Perfectly moisturizes and cleanses soldered surfaces and protects them against oxidation. MICRO CHIP ELECTRONIC ART.058
No product available!
Liquid flux in the form of a rosin solution with the addition of organic activators, in a bottle with a capacity of 500 ml. AG Termopasty ART.AGT-075
Rosin flux in a 1000 ml plastic bottle. AG Termopasty ART.AGT-043
A rosin-free, liquid flux intended for the application of the liquid Sn60/Pb alloy on printed circuit boards in tinplate rollers. 100 ml bottle. AG Termopasty ART.AGT-110