Flux varnish LT-4 100ml AG

Gel flux is a thickened RMA class rosin flux intended for SMT assembly and repairs. AG Termopasty ART.AGT-089

Thickened rosin flux intended for SMT assembly and repair. In a 10 ml cartridge. AG Termopasty ART.AGT-179

Soldering acid for soldering of non-nickel-plated nickel plated surfaces. AG Termopasty ART.AGT-117

The fluid is intended for soft soldering of galvanized sheets and pure zinc. 50 ml bottle. AG Termopasty ART.AGT-204

Rosin flux intended for assembly and repair of SMT components. Dispenser with a capacity of 10 g. Alpha RMA 7

A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 1000 ml bottle. AG Termopasty ART.AGT-074

Alpha SAC305 Omnix 338 is a high-quality rosin gel flux designed for lead-free BGA soldering, providing excellent component adhesion. The product is halogen-free (ROL0), which minimizes corrosion and ensures clean connections in accordance with RoHS standards.

AG 50 soldering acid with a brush. The product is intended for soldering of nickel plated surfaces. AG Termopasty ART.AGT-253

Flux TK83 is an alcohol solution for soldering with the addition of organic activators. AG Termopasty ART.AGT-045

Flux gel is a thickened rosin flux class RMA designed for SMT assembly and repairs. AG Termopasty ART.AGT-047

Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 500 ml bottle. AG Thermopasty ART.AGT-082

Liquid flux in the form of a rosin solution with the addition of organic activators, in a bottle with a capacity of 500 ml. AG Termopasty ART.AGT-075

Broquetas BTFO-81-2H flux in gel form, 10 ml, is an effective tool for precise manual soldering of electronic components. Its halogenated ROM1 formula provides good wettability and high-quality solder joints, especially in applications requiring cleanliness and durability. Ideal for repair work and manual assembly in precision electronics.

Flux TK 83 50ml AG with brush enables precise SMD and BGA assembly, soldering of electronic components, and tinning wire ends in electronics and robotics. The product is recommended for service applications and device assembly, as well as workshop tasks requiring high-quality solder joints and easy dosing of the flux. Residues can remain on PCBs, but for complete cleanliness, their removal with isopropyl alcohol is advised. AG Termopasty ART.AGT-044

Soldering acid intended for hard-to-solder nickel-plated surfaces. 1000 ml bottle. AG Termopasty ART.AGT-271

Soldering rosin with the addition of activators, thanks to which it has an activity similar to solder paste. 500 g package. AG Termopasty ART.AGT-268