Flux varnish LT-4 100ml AG

Kester 951 is a halogen-free, chlorophyll Flux Pen® applicator, specially designed for surface soldering.

A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 100 ml bottle. AG Termopasty ART.AGT-041

Soldering paste medium-active flux with the consistency of a paste based on rosin and organic halogen activator, facilitating the soldering of copper, silver, zinc and nickel elements. AG Termopasty ART.AGT-038

Alpha SAC305 Omnix 338 is a high-quality rosin gel flux designed for lead-free BGA soldering, providing excellent component adhesion. The product is halogen-free (ROL0), which minimizes corrosion and ensures clean connections in accordance with RoHS standards.

Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 500 ml bottle. AG Thermopasty ART.AGT-082

A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 500 ml bottle. AG Termopasty ART.AGT-073

Flux intended for soldering and welding with brass solders. Dissolves metal oxides and facilitates the bonding of solder to the material. AG Borax ART. AGT-121

A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 1000 ml bottle. AG Termopasty ART.AGT-074

Soldering acid intended for hard-to-solder nickel-plated surfaces. 500 ml bottle. AG Termopasty ART.AGT-272

Flux gel is a thickened rosin flux class RMA designed for SMT assembly and repairs. AG Termopasty ART.AGT-047

Paste flux intended for soft soldering of metals. 40 ml package. AG Termopasty ART.AGT-203

Soldering rosin with the addition of activators, thanks to which it has an activity similar to solder paste. 500 g package. AG Termopasty ART.AGT-094

High quality and clean medium active flux that facilitates precise soldering. Perfectly moisturizes and cleanses soldered surfaces and protects them against oxidation. MICRO CHIP ELECTRONIC ART.056

Soldering paste in a metal box with a capacity of 20 g. Facilitates soldering of electronic components. AG Termopasty ART.AGT-036

Soldering rosin with the addition of activators. Made of pine resin, it prevents oxidation of joints and eliminates the formation of cold solders. The package contains 45 g of flux

Rosin flux intended for assembly and repair of SMD and BGA components. Cartridge with a capacity of 10 g. Alpha OM-338