Easy Print Sn96.5Ag3Cu0.5 solder paste 250 g plastic box
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  • Easy Print Sn96.5Ag3Cu0.5 solder paste 250 g plastic box
ID: 584390
5901764329411
zł216.64
Tax included

zł176.13 tax excl.

No Clean paste for soldering SMD components, containing a resin and solvent-based flux and thixotropic additives, retains its physicochemical properties for 20 hours on a PCB board, does not contain chlorides, and the flux residue does not corrode and does not require washing, ensuring good properties of soldered joints mechanical and electrical. ART.AGT-031

2 weeks
On request

 

Free shipping

free shipping in Poland for all orders over 500 PLN

 

Same day shipping

If your payment will be credited to our account by 11:00

 

14 days for return

Each consumer can return the purchased goods within 14 days

Description

No Clean paste intended for soldering SMD components in processes that do not include washing phases. In addition to metal powder, the product contains a flux based on resin and solvent, oxide-removing activators and thixotropic additives responsible for viscosity and plasticity. The paste does not lose its physicochemical properties even after 20 hours of being left on the PCB. This time depends on the conditions in the room: humidity and temperature.

Additional properties

  • does not contain chlorides
  • the flux residue does not corrode and does not require washing
  • soldered connections have good mechanical and electrical properties

584390

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