Easy Print Sn96.5Ag3Cu0.5 solder paste 250 g plastic box

Soldering paste medium-active flux with the consistency of a paste based on rosin and organic halogen activator, facilitating the soldering of copper, silver, zinc and nickel elements. AG Termopasty ART.AGT-038

RF800 flux is a medium-active rosin solution that does not require washing. AG Termopasty ART.AGT-042

Solder paste used in the SMD soldering process. It is suitable for both automatic soldering and manual printers. ThermoPasts ART.AGT-030

Liquid flux in the form of a rosin solution with the addition of organic activators, in a bottle with a capacity of 500 ml. AG Termopasty ART.AGT-075

Liquid, rosin-free flux intended for high-temperature tinning and soldering of painted elements. 100 ml bottle. AG Termopasty ART.AGT-040

Soldering rosin with the addition of activators, thanks to which it has an activity similar to solder paste. 500 g package. AG Termopasty ART.AGT-094

Flux gel is a thickened rosin flux class RMA designed for SMT assembly and repairs. AG Termopasty ART.AGT-088

Soldering acid for soldering of non-nickel-plated nickel plated surfaces. AG Termopasty ART.AGT-117

Liquid, rosin-free flux intended for high-temperature tinning and soldering of painted elements. 1000 ml bottle. AG Termopasty ART.AGT-072

High quality and clean medium active flux that facilitates precise soldering. Perfectly moisturizes and cleanses soldered surfaces and protects them against oxidation. MICRO CHIP ELECTRONIC ART.057

Soldering acid intended for hard-to-solder nickel-plated surfaces. 1000 ml bottle. AG Termopasty ART.AGT-271

High quality and clean medium active flux that facilitates precise soldering. Perfectly moisturizes and cleanses soldered surfaces and protects them against oxidation. MICRO CHIP ELECTRONIC  ART.058

No Clean paste for soldering SMD components, containing a resin and solvent-based flux and thixotropic additives, retains its physicochemical properties for 20 hours on a PCB board, does not contain chlorides, and the flux residue does not corrode and does not require washing, ensuring good properties of soldered joints mechanical and electrical. ART.AGT-027

Alpha SAC305 Omnix 338 is a high-quality rosin gel flux designed for lead-free BGA soldering, providing excellent component adhesion. The product is halogen-free (ROL0), which minimizes corrosion and ensures clean connections in accordance with RoHS standards.

Flux TK83 is an alcohol solution for soldering with the addition of organic activators. AG Termopasty ART.AGT-045

Thickened rosin flux intended for SMT assembly and repair. In a 10 ml cartridge. AG Termopasty ART.AGT-179