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The Intel Edison platform is based on a dual-core Intel Atom processor made in the 22nm process and has embedded Bluetooth LE module, Wi-Fi. The microcomputer has been designed to create the "Internet of Things" and small-sized systems that are used in everyday use, the board has a small size and is characterized by high efficiency with low energy consumption. The platform is equipped with a Bluetooth 4.0 module and a Wi-Fi module supporting the 2.4GHz and 5GHz bands. The board has a built-in antenna for wireless communication.


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Pin strip straight in black, double-breasted, female, 2x7, pitch 2.54mm, THT, RoHS. PBD14S
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ROSA3D filament made of high quality PVB. 0.5 kg of filament with a diameter of 1.75 mm is wound on the spool. ROSA3D PVB Navy Smooth
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PCB for modular listening receiver for the 80m and 40m Dosia bands - VFO module. AVT3195 A
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Assembled, accurate clock with 20mm display set by means of GPS. AVT5522 / 1 C
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ROSA3D filament made of high-quality PLA granules. 0.8 kg of filament with a diameter of 1.75 mm is wound on the spool. ROSA3D PLA Starter Neon Green
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Intel Edison platform with built-in antenna. Intel Atom 500MHz processor, 1GB RAM, supply voltage 3.15..4.5V, I2C, I2S, SD Card, SPI, UART, USB interfaces. EDI2.SPON.AL.S