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Liquid flux in the form of a rosin solution with the addition of organic activators, in a 10 ml marker. Kester 186
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Each consumer can return the purchased goods within 14 days
No-Clean flux is an alcohol solution for soldering with the addition of organic activators. Suitable for hand tinning to restore solderability. It does not require removal after use, which improves the convenience of use.
It is used for cleaning PCBs, it is made of materials that prevent ESD discharges. Ideally suited for spot cleaning
AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-306
High quality and clean medium active flux that facilitates precise soldering. Perfectly moisturizes and cleanses soldered surfaces and protects them against oxidation. MICRO CHIP ELECTRONIC ART.057
Rosin flux in a 100 ml plastic bottle with a brush. AG Termopasty ART.AGT-109
Rosin flux in a 50 ml plastic bottle with a brush. AG Termopasty ART.AGT-248
Liquid flux in the form of a rosin solution with the addition of organic activators, in a bottle with a capacity of 500 ml. AG Termopasty ART.AGT-075
The fluid is intended for soft soldering of galvanized sheets and pure zinc. 100 ml bottle. AG Termopasty ART.AGT-205
Liquid flux in the form of a rosin solution with the addition of organic activators, in a bottle with a capacity of 1000 ml. AG Termopasty ART.AGT-076
Aerosol varnish to protect printed circuit boards against oxidation. AG Termopasty ART.AGT-235
A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 1000 ml bottle. AG Termopasty ART.AGT-074
Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 1000 ml bottle. AG Thermopasty ART.AGT-083
A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 500 ml bottle. AG Termopasty ART.AGT-073
Rosin flux in a 1000 ml plastic bottle. AG Termopasty ART.AGT-043
High quality and clean medium active flux that facilitates precise soldering. Perfectly moisturizes and cleanses soldered surfaces and protects them against oxidation. MICRO CHIP ELECTRONIC ART.056
Liquid, rosin-free flux intended for high-temperature tinning and soldering of painted elements. 500 ml bottle. AG Termopasty ART.AGT-071
High quality and clean medium active flux that facilitates precise soldering. Perfectly moisturizes and cleanses soldered surfaces and protects them against oxidation. MICRO CHIP ELEKTRONIC ART.055
A rosin-free, liquid flux intended for the application of the liquid Sn60/Pb alloy on printed circuit boards in tinplate rollers. 100 ml bottle. AG Termopasty ART.AGT-110
Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 500 ml bottle. AG Thermopasty ART.AGT-082
Liquid flux in the form of a rosin solution with the addition of organic activators, in a 10 ml marker. Kester 186