No-Clean flux is an alcohol solution for soldering with the addition of organic activators. Suitable for hand tinning to restore solderability. It does not require removal after use, which improves the convenience of use.
Manufacturer BTC Korporacja sp. z o. o. Lwowska 5 05-120 Legionowo Poland sprzedaz@kamami.pl 22 767 36 20
Responsible person BTC Korporacja sp. z o. o. Lwowska 5 05-120 Legionowo Poland sprzedaz@kamami.pl 22 767 36 20
It is used for cleaning PCBs, it is made of materials that prevent ESD discharges. Ideally suited for spot cleaning
AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-306
Liquid flux in the form of a rosin solution with the addition of organic activators, in a bottle with a capacity of 500 ml. AG Termopasty ART.AGT-075
Liquid flux in the form of a rosin solution with the addition of organic activators, in a bottle with a capacity of 1000 ml. AG Termopasty ART.AGT-076
The fluid is intended for soft soldering of galvanized sheets and pure zinc. 50 ml bottle. AG Termopasty ART.AGT-204
The fluid is intended for soft soldering of galvanized sheets and pure zinc. 100 ml bottle. AG Termopasty ART.AGT-205
Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 500 ml bottle. AG Thermopasty ART.AGT-082
Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 1000 ml bottle. AG Thermopasty ART.AGT-083
Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 100 ml bottle. AG Thermopasty ART.AGT-046
Aerosol varnish to protect printed circuit boards against oxidation. AG Termopasty ART.AGT-235
Liquid, rosin-free flux intended for high-temperature tinning and soldering of painted elements. 100 ml bottle. AG Termopasty ART.AGT-040
Liquid, rosin-free flux intended for high-temperature tinning and soldering of painted elements. 500 ml bottle. AG Termopasty ART.AGT-071
Liquid, rosin-free flux intended for high-temperature tinning and soldering of painted elements. 1000 ml bottle. AG Termopasty ART.AGT-072
A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 100 ml bottle. AG Termopasty ART.AGT-041
A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 500 ml bottle. AG Termopasty ART.AGT-073
A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 1000 ml bottle. AG Termopasty ART.AGT-074
A rosin-free, liquid flux intended for the application of the liquid Sn60/Pb alloy on printed circuit boards in tinplate rollers. 100 ml bottle. AG Termopasty ART.AGT-110
Liquid flux in the form of a rosin solution with the addition of organic activators, in a 10 ml marker. Kester 186
Liquid flux in the form of a rosin solution with the addition of organic activators, in a 10 ml marker. Kester 186