No-Clean flux is an alcohol solution for soldering with the addition of organic activators. Suitable for hand tinning to restore solderability. It does not require removal after use, which improves the convenience of use.
Manufacturer BTC Korporacja sp. z o. o. Lwowska 5 05-120 Legionowo Poland sprzedaz@kamami.pl 22 767 36 20
Responsible person BTC Korporacja sp. z o. o. Lwowska 5 05-120 Legionowo Poland sprzedaz@kamami.pl 22 767 36 20
It is used for cleaning PCBs, it is made of materials that prevent ESD discharges. Ideally suited for spot cleaning
AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-306
High quality and clean medium active flux that facilitates precise soldering. Perfectly moisturizes and cleanses soldered surfaces and protects them against oxidation. MICRO CHIP ELEKTRONIC ART.055
The fluid is intended for soft soldering of galvanized sheets and pure zinc. 100 ml bottle. AG Termopasty ART.AGT-205
Liquid, rosin-free flux intended for high-temperature tinning and soldering of painted elements. 500 ml bottle. AG Termopasty ART.AGT-071
Kester 951 is a halogen-free, chlorophyll Flux Pen® applicator, specially designed for surface soldering.
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The fluid is intended for soft soldering of galvanized sheets and pure zinc. 50 ml bottle. AG Termopasty ART.AGT-204
A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 100 ml bottle. AG Termopasty ART.AGT-041
Flux TK83 is an alcohol solution for soldering with the addition of organic activators. AG Termopasty ART.AGT-045
High quality and clean medium active flux that facilitates precise soldering. Perfectly moisturizes and cleanses soldered surfaces and protects them against oxidation. MICRO CHIP ELECTRONIC ART.056
Liquid, rosin-free flux intended for high-temperature tinning and soldering of painted elements. 100 ml bottle. AG Termopasty ART.AGT-040
Aerosol varnish to protect printed circuit boards against oxidation. AG Termopasty ART.AGT-235
Rosin flux in a 100 ml plastic bottle with a brush. AG Termopasty ART.AGT-109
Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 50 ml bottle. AG Thermopasty ART.AGT-323
Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 1000 ml bottle. AG Thermopasty ART.AGT-083
Rosin flux in a 50 ml plastic bottle with a brush. AG Termopasty ART.AGT-248
Liquid flux in the form of a rosin solution with the addition of organic activators, in a marker with a capacity of 8 ml. AG Termopasty ART.AGT-249
A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 1000 ml bottle. AG Termopasty ART.AGT-074
Liquid flux in the form of a rosin solution with the addition of organic activators, in a 10 ml marker. Kester 186