- New
zł369.59 tax excl.
Compact MiniWare MHP50-C5 solder pot with an adjustable temperature range from 50°C to 350°C and a capacity of approximately 70 g of solder alloy. The modular MHP50 design, color LCD, and support for DC and USB PD power supplies facilitate tinning wires, terminals, and small electronic components. MiniWare MHP50-C5
MiniWare MHP50-C5 enables solder alloy melting and tinning of wires, terminals, and small electronic components within a temperature range from 50°C to 350°C. The 30 x 30 x 9.3 mm solder pot holds approximately 70 g of solder alloy, with the manufacturer specifying a complete melting time of approximately 2 minutes. The MHP50 system features a modular design that allows the heating element to be replaced with other compatible accessories, including a hot plate. Operation is controlled using a 160 x 80 px color LCD and two buttons, while the thermal insulation system incorporates a fan with temperature-dependent speed control. Power can be supplied through the 5.5/2.5 mm DC input at 19-24 V and up to 150 W, or via USB PD at 20-28 V and up to 130 W.
Manufacturer BTC Korporacja sp. z o. o. Ludwinowo Zegrzyńskie 52G 05-140 Ludwinowo Zegrzyńskie Poland sprzedaz@kamami.pl 22 767 36 20
Responsible person BTC Korporacja sp. z o. o. Ludwinowo Zegrzyńskie 52G 05-140 Ludwinowo Zegrzyńskie Poland sprzedaz@kamami.pl 22 767 36 20
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Compact MiniWare MHP50-C5 solder pot with an adjustable temperature range from 50°C to 350°C and a capacity of approximately 70 g of solder alloy. The modular MHP50 design, color LCD, and support for DC and USB PD power supplies facilitate tinning wires, terminals, and small electronic components. MiniWare MHP50-C5
No product available!
Compact MiniWare MHP50-C5 solder pot with an adjustable temperature range from 50°C to 350°C and a capacity of approximately 70 g of solder alloy. The modular MHP50 design, color LCD, and support for DC and USB PD power supplies facilitate tinning wires, terminals, and small electronic components. MiniWare MHP50-C5