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Lead-free tin Sn99.3Cu0.7 with flux, 100 g spool, 0.25 mm diameter
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Lead-free tin by Cynel with flux on a spool of 100 g, diameter 0.25 mm. Sn99.3Cu0.7 alloy produced from the purest raw materials (tin, copper) in accordance with ISO EN 9453: 2014.
The binder is intended for mechanized soldering in electronics, electrical engineering and other branches where compliance with the RoHS2 directive is required.
Chemical characteristic
Pb | Sb | Bi | Cu | Au | In | Ag | Al | As | Cd | Fe | Ni | Zn |
---|---|---|---|---|---|---|---|---|---|---|---|---|
0,07 | 0,1 | 0,1 | 0,5 | 0,05 | 0,1 | 0,1 | 0,001 | 0,03 | 0,002 | 0,02 | 0,01 | 0,001 |
Physical characteristics
Solder tape used to collect excess tin, 1 mm wide, 1.5 m long
The sucker is a tool necessary to remove excess brazing material during desoldering of electronic components. NAR0032
No product available!
Soldering tape used to collect excess tin with a gray 1.5 mm, 1.5 m long
Tape, in the form of a braid, to remove the excess of molten solder brazing material during soldering and desoldering of electronic components 1.5m
Lead-free Sn99.3Cu0.7 1.1.3 solder wire, manufactured in accordance with the EN ISO 9453:2014 standard, combines rosin, halide-free 1.1.3 flux with high-quality binder, meeting the requirements of the RoHS2 directive and guaranteeing performance in electronics and electrical engineering
No product available!
Lead-free Sn99.3Cu0.7 1.1.3 solder wire, manufactured in accordance with the EN ISO 9453:2014 standard, combines rosin, halide-free 1.1.3 flux with high-quality binder, meeting the requirements of the RoHS2 directive and guaranteeing performance in electronics and electrical engineering
No product available!
Lead-free Sn99.3Cu0.7 1.1.3 solder wire, manufactured in accordance with the EN ISO 9453:2014 standard, combines rosin, halide-free 1.1.3 flux with high-quality binder, meeting the requirements of the RoHS2 directive and guaranteeing performance in electronics and electrical engineering
No product available!
Lead-free Sn99.3Cu0.7 1.1.3 solder wire, manufactured in accordance with the EN ISO 9453:2014 standard, combines rosin, halide-free 1.1.3 flux with high-quality binder, meeting the requirements of the RoHS2 directive and guaranteeing performance in electronics and electrical engineering
Lead-free Sn99.3Cu0.7 1.1.3 solder wire, manufactured in accordance with the EN ISO 9453:2014 standard, combines rosin, halide-free 1.1.3 flux with high-quality binder, meeting the requirements of the RoHS2 directive and guaranteeing performance in electronics and electrical engineering
No product available!
Lead-free tin Sn99.3Cu0.7 with flux (250g spool), diameter 0.50mm. CYNEL
Lead-free Sn99.3Cu0.7 1.1.3 solder wire, manufactured in accordance with the EN ISO 9453:2014 standard, combines rosin, halide-free 1.1.3 flux with high-quality binder, meeting the requirements of the RoHS2 directive and guaranteeing performance in electronics and electrical engineering
No product available!
Lead-free Sn99.3Cu0.7 1.1.3 solder wire, manufactured in accordance with the EN ISO 9453:2014 standard, combines rosin, halide-free 1.1.3 flux with high-quality binder, meeting the requirements of the RoHS2 directive and guaranteeing performance in electronics and electrical engineering
No product available!
Lead-free Sn99.3Cu0.7 1.1.3 solder wire, manufactured in accordance with the EN ISO 9453:2014 standard, combines rosin, halide-free 1.1.3 flux with high-quality binder, meeting the requirements of the RoHS2 directive and guaranteeing performance in electronics and electrical engineering
No product available!
Lead-free tin Sn99.3Cu0.7 with flux (500g spool), diameter 0.50mm. CYNEL
Lead-free Sn99.3Cu0.7 1.1.3 solder wire, manufactured in accordance with the EN ISO 9453:2014 standard, combines rosin, halide-free 1.1.3 flux with high-quality binder, meeting the requirements of the RoHS2 directive and guaranteeing performance in electronics and electrical engineering
No product available!
Lead-free Sn99.3Cu0.7 1.1.3 solder wire, manufactured in accordance with the EN ISO 9453:2014 standard, combines rosin, halide-free 1.1.3 flux with high-quality binder, meeting the requirements of the RoHS2 directive and guaranteeing performance in electronics and electrical engineering
No product available!
Lead-free Sn99.3Cu0.7 1.1.3 solder wire, manufactured in accordance with the EN ISO 9453:2014 standard, combines rosin, halide-free 1.1.3 flux with high-quality binder, meeting the requirements of the RoHS2 directive and guaranteeing performance in electronics and electrical engineering
No product available!
Lead-free Sn99.3Cu0.7 1.1.3 solder wire, manufactured in accordance with the EN ISO 9453:2014 standard, combines rosin, halide-free 1.1.3 flux with high-quality binder, meeting the requirements of the RoHS2 directive and guaranteeing performance in electronics and electrical engineering
No product available!
Lead-free Sn99.3Cu0.7 1.1.3 solder wire, manufactured in accordance with the EN ISO 9453:2014 standard, combines rosin, halide-free 1.1.3 flux with high-quality binder, meeting the requirements of the RoHS2 directive and guaranteeing performance in electronics and electrical engineering
No product available!
Lead-free Sn99.3Cu0.7 1.1.3 solder wire, manufactured in accordance with the EN ISO 9453:2014 standard, combines rosin, halide-free 1.1.3 flux with high-quality binder, meeting the requirements of the RoHS2 directive and guaranteeing performance in electronics and electrical engineering
No product available!
Lead-free tin Sn99.3Cu0.7 with flux, 100 g spool, 0.25 mm diameter