Aluminum heat sink for Raspberry Pi 4 model B minicomputers. It helps to provide additional heat dissipation from key components on the board.
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AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-303
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AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-159
TO220 thermal conductive pads are characterized by high thermal conductivity (1.5 W/mK) and at the same time are an effective electrical insulator. They can be used with various types of transistors, improving their work. They do not contain glue. AG Thermopaste ART.AGT-241
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A set of four heat sinks (three ceramic and one aluminum) for Raspberry Pi 4 model B minicomputers. Equipped with self-adhesive tape for easy installation
A set of four aluminum heat sinks for Raspberry Pi 4 model B minicomputers. Equipped with an adhesive tape for easy installation
Aluminum heat sink for minicomputers Raspberry Pi 4 model B. Equipped with self-adhesive tape for easy installation
Aluminum heat sink for minicomputers Raspberry Pi 4 model B. Equipped with self-adhesive tape for easy installation
A set of four aluminum heat sinks for Raspberry Pi 4 model B minicomputers. Equipped with an adhesive tape for easy installation
Aluminum heat sink for minicomputers Raspberry Pi 4 model B.