AG Thermopad 30x30x0.5 (6 W/mK) - thermal conductive tape without glue
ID: 587781
zł6.52
Tax included
zł5.30 tax excl.
AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-306
Free shipping
free shipping in Poland for all orders over 500 PLN
Same day shipping
If your payment will be credited to our account by 11:00
14 days for return
Each consumer can return the purchased goods within 14 days
Description
AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. It will be used in LED lighting systems and between heat-generating semiconductors and a heat sink.
Features
- Thermal conductivity: 6 W/mK
- Thickness: 0.5mm
- Density: 3g/cm3
- Hardness [Shore]: 30 ± 5
- Operating temperature range: -60~+200°C
- Resistance: 1,1x1011 Ohm/m
- Dielectric constant [1000Hz]: 7,5
587781
You might also like
Silicone thermal grease used to improve the amount of heat transferred to, for example, the heat sink. The paste is resistant to oxidation and operating temperature in the range from -50 to 200 ° C. Paste in a tube with a capacity of 7 g. AG Termopasty ART.AGT-055
zł4.03
24h
Available quantity: 23
Available
Silicone thermal grease used to improve the amount of heat transferred to, for example, the heat sink. The paste is resistant to oxidation and operating temperature in the range from -50 to 200 ° C. Paste in a syringe with a capacity of 25 g. AG Termopasty ART.AGT-056
zł13.96
24h
Available quantity: 9
Available
Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-057
zł14.62
24h
Available quantity: 19
Available
The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-116
zł9.20
24h
Available quantity: 13
Available
Other products in the same category (16)
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-159
zł6.69
24h
Available quantity: 21
Available
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-135
zł11.02
2 weeks
No product available!
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-137
zł7.65
24h
Available quantity: 10
Available
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-194
zł296.73
2 weeks
No product available!
AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-302
zł6.81
2 weeks
No product available!
AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-292
zł104.14
2 weeks
No product available!
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-191
zł748.58
2 weeks
No product available!
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-192
zł928.83
2 weeks
No product available!
HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-125
zł36.42
24h
Available quantity: 5
Available
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-158
zł7.21
2 weeks
No product available!
Foam with a density of 0.99 g/cm3 and a slightly alkaline pH (7-8) helps to find any gas or air leaks. AG Termopasty ART.AGT-133
zł21.25
24h
Available quantity: 14
Available
TO220 thermal conductive pads are characterized by high thermal conductivity (1.5 W/mK) and at the same time are an effective electrical insulator. They can be used with various types of transistors, improving their work. They do not contain glue. AG Thermopaste ART.AGT-241
zł1.12
24h
Available quantity: 10
Available
AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-299
zł5.55
2 weeks
No product available!
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-195
zł403.58
2 weeks
No product available!
HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-127
zł31.46
24h
Available quantity: 2
Available
The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-116
zł9.20
24h
Available quantity: 20
Available
AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-306