Thermal glue AG TermoGlue 10g
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  • Thermal glue AG TermoGlue 10g
ID: 551083
5901764327097
zł9.43
Tax included

zł7.67 tax excl.

The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-116

24h
Available
Available quantity: 182
 

Free shipping

free shipping in Poland for all orders over 500 PLN

 

Same day shipping

If your payment will be credited to our account by 11:00

 

14 days for return

Each consumer can return the purchased goods within 14 days

Description

AG TermoGlue thermal adhesive is used to attach radiators placed on memory chips, transistors or bridges, among others. It is an excellent way to create permanent connections. The use of the adhesive allows for excellent heat conduction parameters. Another application is connecting and filling gaps between heating elements. It is worth remembering not to exceed the maximum thickness, which is 6 mm. The white thermal adhesive took about 24 hours to dry.

Features

  • Heat-conducting glue
  • White color
  • Thermal conductivity: 1 W / mK
  • Maximum working temperature: 200 ° C
  • Electrical puncture resistance: min. 20 kV / mm
  • Tensile strength: 2 MPa
  • Dielectric constant: 3
  • Drying time: 8 minutes
  • Weight: 10 g (net)
551083

Data sheet

Capacity
10 g
Type of packaging
Tube
Dispenser type
Cap

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