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![Thermal glue AG TermoGlue 10g](https://kamami.pl/73230-large_default/thermal-glue-ag-termoglue-10g.jpg)
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The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-116
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AG TermoGlue thermally conductive adhesive is used to fix heat sinks located, among others, in on memory chips, transistors or bridges. It's a great way to create lasting connections. Thanks to the use of glue, excellent heat conduction parameters are obtained. Another application is connecting and filling gaps between heating elements. It is worth remembering not to exceed the maximum thickness, which is 6 mm. It took about 24 hours for the white thermally conductive adhesive to dry.
Silicone thermal grease used to improve the amount of heat transferred to, for example, the heat sink. The paste is resistant to oxidation and operating temperature in the range from -50 to 200 ° C. Paste in a tube with a capacity of 7 g. AG Termopasty ART.AGT-055
Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-057
AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-292
No product available!
Silicone thermal grease used to improve the amount of heat transferred to, for example, the heat sink. The paste is resistant to oxidation and operating temperature in the range from -50 to 200 ° C. Paste in a cartridge with a capacity of 400 g. AG Termopasty ART.AGT-311
HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-113
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-161
No product available!
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-155
No product available!
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-159
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-156
No product available!
Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 1000g in a plastic box. AG Termopasty ART.AGT-150
No product available!
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-134
Silicone thermal grease used to improve the amount of heat transferred to, for example, the heat sink. The paste is resistant to oxidation and operating temperature in the range from -50 to 200 ° C. Paste in a tube with a capacity of 7 g. AG Termopasty ART.AGT-055
Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-058
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-156
No product available!
Foam with a density of 0.99 g/cm3 and a slightly alkaline pH (7-8) helps to find any gas or air leaks. AG Termopasty ART.AGT-133
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-140
Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 100g in a plastic box. AG Termopasty ART.AGT-247
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-191
No product available!
The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-116