zł23.14 tax excl.
BLOW thermal paste with a conductivity of 12.5 W/m·K in a 4 g package is a high-performance heat-conducting material, ideal for use in computers and electronic devices. It provides excellent heat dissipation efficiency, is non-conductive electrically, and does not require special application conditions. The included syringe and spatula allow for precise and clean application of the product.
BLOW thermal paste with high thermal conductivity of 12.5 W/m·K is designed for use in electronic and computer systems that require efficient heat dissipation. It is ideal for mounting heatsinks, CPUs, GPUs, and other electronic components. With low thermal resistance and stable thermal properties, it ensures effective heat transfer from the first application—no curing required.
The paste is electrically non-conductive, non-drying, and non-corrosive, increasing operational safety and protecting components from damage. The syringe packaging allows for precise and repeated application, and the included spatula ensures even distribution on contact surfaces.
Manufacturer Prolech sp. z o. o. Stary Puznów 58 B 08-400 Garwolin Poland biuro@prolech.pl
Responsible person Prolech sp. z o. o. Stary Puznów 58 B 08-400 Garwolin Poland biuro@prolech.pl
AG Gold is a thermal paste with the addition of gold. It is characterized by high thermal conductivity (>2.8 W/mK), which is up to three times higher than in the case of introducing products. AG Termopasty ART.AGT-119
The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-180
AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. A paste weighing 1000 g in a plastic box. AG Termopasty ART.AGT-149
No product available!
AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. A paste weighing 100 g in a plastic box. AG Termopasty ART.AGT-118
Foam with a density of 0.99 g/cm3 and a slightly alkaline pH (7-8) helps to find any gas or air leaks. AG Termopasty ART.AGT-133
HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-127
HPX thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-114
No product available!
N silicone paste with a density of 1.02-1.04 g/cm3 is a product characterized by protective properties. It preserves rubber in particular, as well as plastics, preventing punctures. AG Termopasty ART.AGT-054
No product available!
Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-058
Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-059
No product available!
Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-120
No product available!
HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-113
HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-125
HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-284
HPX thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-128
HPX thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-126
BLOW thermal paste with a conductivity of 12.5 W/m·K in a 4 g package is a high-performance heat-conducting material, ideal for use in computers and electronic devices. It provides excellent heat dissipation efficiency, is non-conductive electrically, and does not require special application conditions. The included syringe and spatula allow for precise and clean application of the product.