Thermal Paste 4g 12.5 W/mK Blow
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  • Thermal Paste 4g 12.5 W/mK Blow
ID: 1197196
5900804137108
zł28.46
Tax included

zł23.14 tax excl.

BLOW thermal paste with a conductivity of 12.5 W/m·K in a 4 g package is a high-performance heat-conducting material, ideal for use in computers and electronic devices. It provides excellent heat dissipation efficiency, is non-conductive electrically, and does not require special application conditions. The included syringe and spatula allow for precise and clean application of the product.

24h
Available
Available quantity: 4

Description

BLOW thermal paste with high thermal conductivity of 12.5 W/m·K is designed for use in electronic and computer systems that require efficient heat dissipation. It is ideal for mounting heatsinks, CPUs, GPUs, and other electronic components. With low thermal resistance and stable thermal properties, it ensures effective heat transfer from the first application—no curing required.

The paste is electrically non-conductive, non-drying, and non-corrosive, increasing operational safety and protecting components from damage. The syringe packaging allows for precise and repeated application, and the included spatula ensures even distribution on contact surfaces.

Features

  • Color: Gray
  • Thermal conductivity: 12.5 W/m·K
  • Thermal impedance: 0.0032°C/W
  • Volume: 4 g / 1.1 ml
  • Electrically non-conductive
  • Non-drying, non-corrosive
  • No curing required
  • Moisture protection
  • Optimal viscosity and density
  • Easy to apply and remove
  • Syringe packaging + spatula for application
1197196

Data sheet

Capacity
4 g
Type of packaging
Syringe
Dispenser type
Cap

Manufacturer Prolech sp. z o. o. Stary Puznów 58 B 08-400 Garwolin Poland biuro@prolech.pl

Responsible person Prolech sp. z o. o. Stary Puznów 58 B 08-400 Garwolin Poland biuro@prolech.pl

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