Thermal Paste 4g 8,5W/mK BLOW
ID: 1197187
5900804137092
zł14.74
Tax included
zł11.98 tax excl.
BLOW thermal paste with a conductivity of 8.5 W/m·K in a 4 g package is a high-performance heat-conducting material, ideal for use in computers and electronic devices. It provides excellent heat dissipation efficiency, is non-conductive electrically, and does not require special application conditions. The included syringe and spatula allow for precise and clean application of the product.
Description
BLOW thermal paste with high thermal conductivity of 8.5 W/m·K is designed for use in electronic and computer systems that require efficient heat dissipation. It is ideal for mounting heatsinks, CPUs, GPUs, and other electronic components. With low thermal resistance and stable thermal properties, it ensures effective heat transfer from the first application—no curing required.
The paste is electrically non-conductive, non-drying, and non-corrosive, increasing operational safety and protecting components from damage. The syringe packaging allows for precise and repeated application, and the included spatula ensures even distribution on contact surfaces.
Features
- Color: Gray
- Thermal conductivity: 8.5 W/m·K
- Thermal impedance: 0.0032°C/W
- Volume: 4 g / 1.1 ml
- Electrically non-conductive
- Non-drying, non-corrosive
- No curing required
- Moisture protection
- Optimal viscosity and density
- Easy to apply and remove
- Syringe packaging + spatula for application
1197187
Data sheet
- Capacity
- 4 g
- Type of packaging
- Syringe
- Dispenser type
- Cap
Manufacturer Prolech sp. z o. o. Stary Puznów 58 B 08-400 Garwolin Poland biuro@prolech.pl
Responsible person Prolech sp. z o. o. Stary Puznów 58 B 08-400 Garwolin Poland biuro@prolech.pl
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