Thermal Paste 4g 12.5 W/mK Blow

Description

BLOW thermal paste with high thermal conductivity of 12.5 W/m·K is designed for use in electronic and computer systems that require efficient heat dissipation. It is ideal for mounting heatsinks, CPUs, GPUs, and other electronic components. With low thermal resistance and stable thermal properties, it ensures effective heat transfer from the first application—no curing required.

The paste is electrically non-conductive, non-drying, and non-corrosive, increasing operational safety and protecting components from damage. The syringe packaging allows for precise and repeated application, and the included spatula ensures even distribution on contact surfaces.

Features

• Color: Gray
• Thermal conductivity: 12.5 W/m·K
• Thermal impedance: 0.0032°C/W
• Volume: 4 g / 1.1 ml
• Electrically non-conductive
• Non-drying, non-corrosive
• No curing required
• Moisture protection
• Optimal viscosity and density
• Easy to apply and remove
• Syringe packaging + spatula for application