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Digilent MXP Wire Wrap - Rozszerzająca płytka prototypowa dla NI myRIO
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  • Digilent MXP Wire Wrap - Rozszerzająca płytka prototypowa dla NI myRIO
  • Digilent MXP Wire Wrap - Rozszerzająca płytka prototypowa dla NI myRIO - widok z góry
  • Digilent MXP Wire Wrap - Rozszerzająca płytka prototypowa dla NI myRIO - widok z dołu
  • Digilent MXP Wire Wrap - Rozszerzająca płytka prototypowa dla NI myRIO - podłączona do NI myRIO
  • Digilent MXP Wire Wrap - Rozszerzająca płytka prototypowa dla NI myRIO - schamat złącza MXP
ID: 560605

large 14x21 hole prototyping area on an expansion card compatible with the myRIO Expansion Port (MXP). 6002-210-008P

Retired
Kamami is the official distributor of Digilent FPGA kits, modules and measurement tools. All products of this brand in our offer are original and come directly from the manufacturer.
 

Free shipping

free shipping in Poland for all orders over 500 PLN

 

Same day shipping

If your payment will be credited to our account by 11:00

 

14 days for return

Each consumer can return the purchased goods within 14 days

Description

The MXP Wire Wrap provides a large 14x21 hole prototyping area on an expansion card compatible with the myRIO Expansion Port (MXP). The MXP Wirewrap functions as an I/O breakout, with bus traces for GND, 3.3V, and 5V on either side of the prototyping area. The MXP Wirewrap's connector is also keyed to ensure correct connection with your NI myRIO.

Features

  • Provides a prototyping area with 14 x 21 plated through-holes (100 mil spacing)
  • Buss traces for GND, 3.3V, and 5V
  • Uses the myRIO Expansion Port (MXP) connector

Package content:

  • MXP Wire Wrap prototyping board
  • Custom cardboard box with protective foam
560605

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