Easy Print Sn96.5Ag3Cu0.5 solder paste 1.4 ml
ID: 584392
zł16.48
Tax included
zł13.40 tax excl.
Solder paste used in the SMD soldering process. It is suitable for both automatic soldering and manual printers. ThermoPasts ART.AGT-028
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14 days for return
Each consumer can return the purchased goods within 14 days
Description
Solder paste used in the SMD soldering process. It is suitable for both automatic soldering and manual printers. It has excellent adhesion even for 24 hours after application. Thanks to its unique properties, this paste minimizes the phenomenon of mid chip solderballing, enabling the creation of high-quality mechanical and electrical connections. The product has been designed to prevent moisture condensation, which can be achieved by bringing the paste to ambient temperature before opening, ensuring that its properties remain in optimal condition.
The paste is based on No Clean flux technology, which eliminates the need for washing. The residues left after paste soldering are minimal, colorless and non-corrosive, which greatly facilitates the testing process.
Features
- Type of binder: Sn96.5Ag3Cu0.5
- Flux classification: REL
- Density ≈ 4.6 g/cm3
- Grain size: 25-45 μm
- Stickiness: 1.0 G/mm2
- Shelf life for printing: over 8 hours
- Packaging: syringe
- Capacity: 1.4 ml
584392
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