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Rosin for soldering with addition of activators, thanks to which this rosin has activity similar to solder paste. The packaging contains 40g of flux. AG Termopasty ART.AGT-034
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Flux (rosin) with the addition of activators to facilitate soldering. The product has activity similar to a solder paste. Used as a base for a reference flux (25% solution in isopropyl alcohol).
Rosin for soldering with addition of activators, thanks to which this rosin has activity similar to solder paste. The packaging contains 100g of flux. AG Termopasty ART.AGT-035
Soldering paste medium-active flux with the consistency of a paste based on rosin and organic halogen activator, facilitating the soldering of copper, silver, zinc and nickel elements. AG Termopasty ART.AGT-038
Rosin for soldering with addition of activators, thanks to which this rosin has activity similar to solder paste. The packaging contains 20g of flux. AG Termopasty ART.AGT-033
Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 100 ml bottle. AG Thermopasty ART.AGT-046
Liquid flux in the form of a rosin solution with the addition of organic activators, in a bottle with a capacity of 500 ml. AG Termopasty ART.AGT-075
Liquid, rosin-free flux intended for high-temperature tinning and soldering of painted elements. 100 ml bottle. AG Termopasty ART.AGT-040
Flux gel is a thickened rosin flux class RMA designed for SMT assembly and repairs. AG Termopasty ART.AGT-047
Liquid flux in the form of a rosin solution with the addition of organic activators, in a bottle with a capacity of 1000 ml. AG Termopasty ART.AGT-076
The fluid is intended for soft soldering of galvanized sheets and pure zinc. 50 ml bottle. AG Termopasty ART.AGT-204
Soldering acid intended for hard-to-solder nickel-plated surfaces. 500 ml bottle. AG Termopasty ART.AGT-272
Kester 951 is a halogen-free, chlorophyll Flux Pen® applicator, specially designed for surface soldering.
A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 1000 ml bottle. AG Termopasty ART.AGT-074
Aerosol varnish to protect printed circuit boards against oxidation. AG Termopasty ART.AGT-235
A rosin-free, liquid flux intended for the application of the liquid Sn60/Pb alloy on printed circuit boards in tinplate rollers. 100 ml bottle. AG Termopasty ART.AGT-110
Soldering paste medium-active flux with the consistency of a paste based on rosin and organic halogen activator, facilitating the soldering of copper, silver, zinc and nickel elements. AG Termopasty ART.AGT-038
High quality and clean medium active flux that facilitates precise soldering. Perfectly moisturizes and cleanses soldered surfaces and protects them against oxidation. MICRO CHIP ELECTRONIC ART.058
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Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 500 ml bottle. AG Thermopasty ART.AGT-082
Soldering acid intended for hard-to-solder nickel-plated surfaces. 1000 ml bottle. AG Termopasty ART.AGT-271
Flux intended for soldering and welding with brass solders. Dissolves metal oxides and facilitates the bonding of solder to the material. AG Borax ART. AGT-121
Rosin for soldering with addition of activators, thanks to which this rosin has activity similar to solder paste. The packaging contains 40g of flux. AG Termopasty ART.AGT-034